Modular Mold for High-Voltage Bushing Condenser Core Impregnation
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Solution Overview
Problem
Existing molds for high-voltage bushing condenser cores face challenges in sealing and pressure application due to complex partition lines, leading to resin leakage and inefficiencies in the curing process, particularly in vacuum molding and APG processes.
Innovation Solution
A modular mold design with axially symmetric cylindrical structure and circular sealing interfaces, allowing for complete vacuum-tightness and independent heat zones for precise temperature control, which enables efficient resin impregnation and curing without the need for a vacuum frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a mold with complex partition lines is used to accommodate the condenser core geometry, then the mold can adapt to the core shape, but sealing becomes difficult and resin leakage occurs
Solution Approach 1:
The mold is divided into multiple modular segments that can be independently assembled and disassembled. Each segment has simplified sealing surfaces, and the modular design allows for easier maintenance and adaptation to different core geometries without compromising sealing integrity.
Solution Approach 2:
A flexible sealing membrane is introduced as an intermediary element between the mold segments. This membrane compensates for minor misalignments and ensures reliable sealing even with complex partition lines, preventing resin leakage while maintaining adaptability.
2Productivity
If pressure is increased to compensate for molding shrinkage, then resin flow is improved, but resin leakage increases due to sealing difficulties
Solution Approach 1:
The flexible sealing membrane acts as a pressure-distributing intermediary that maintains sealing integrity under high pressure conditions, allowing improved resin flow while preventing leakage.
Solution Approach 2:
The sealing system is designed to dynamically adjust its sealing characteristics based on pressure conditions, maintaining effective sealing across the pressure range required for shrinkage compensation.
3Reliability
If the mold is surrounded by a vacuum frame, then vacuum impregnation is achieved, but the device complexity increases
Solution Approach 1:
The vacuum functionality is integrated directly into the mold segments themselves, eliminating the need for a separate vacuum frame. The mold segments are designed with built-in vacuum sealing capabilities, reducing overall system complexity while maintaining impregnation effectiveness.
4Manufacturing precision
If multiple heating zones are implemented for temperature control, then curing uniformity is improved, but the device complexity increases
Solution Approach 1:
The heating system is segmented into multiple independently controlled zones within the mold segments. Each zone can be precisely controlled to maintain optimal curing temperature distribution, improving uniformity while keeping the control system manageable through modular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular mold design ensures high-quality condenser core production with reduced leakage risks and improved temperature control, allowing for precise resin flow and uniform curing, enhancing the stability and efficiency of the high-voltage bushing manufacturing process.
Implementation Method 1
two heat supplying or heat dissipating zones which can be adjusted independently from one another with respect to the supply or dissipation of heat
Implementation Method 2
heating means for controlling the temperature of the mold in a curing process
Implementation Method 3
impregnating a prefabricated condenser core of a high-voltage bushing with a liquid resin
Data Source
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AI summary
The mold (10) is used for impregnating a prefabricated condenser core (C) of a high voltage bushing with a liquid resin and comprises two mold modules (11, 12, 13, 11 a, 11 b) movable against each other and shaped to form an axially symmetric mold cavity (14). The mold (10) forms a column of cylindrical design, in which the at least two mold modules are arranged on top of each other. A first (12) of the two mold modules is executed as hollow cylinder. Two opposing front faces (111, 121) of the two mold modules and a circular O-ring arranged between the two opposing front faces form a first sealing interface (S1) of the metal mold. Such a mold has a very efficient sealing system and allows high pressures to be applied to the liquid resin and a beneficial forming of the condenser core in a device in which the resin is cured according to a specific temperature profile.