Modular Neural Interface with Releasable Electronics Module
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Solution Overview
Problem
Current high-channel count neural recording systems face challenges with space constraints, high fabrication costs, and low yield due to the integration of neural interfaces with active electronics, as well as limitations in channel density and ease of verification and replacement.
Innovation Solution
A modular, high-density electrical system comprising a neural interface component with a flexible substrate and independent electronics module subsystem, allowing for releasable connections and easy replacement of the neural interface component, enabling customization and reducing the overall system size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If neural interface is combined with active circuitry through simultaneous fabrication, then electrical performance is improved, but fabrication cost increases significantly and yield decreases
Solution Approach 1:
The system divides the neural recording system into separate modular components: the neural interface probe and the active electronics module. This segmentation allows each component to be optimized and manufactured independently, reducing fabrication costs while maintaining electrical performance through separate specialized manufacturing processes.
Solution Approach 2:
The patent introduces a flexible printed circuit board (FPC) as an intermediary component that connects the neural interface probe to the active electronics module. This FPC serves as a mediator that enables electrical connection without requiring direct integration, thus avoiding the high fabrication costs associated with simultaneous fabrication while maintaining signal integrity.
2Measurement precision
If neural interface is combined with active circuitry, then electrical performance is improved, but system reliability decreases due to low yield
Solution Approach 1:
By segmenting the system into separate neural interface and electronics modules, the patent enables independent testing and validation of each component. This modular approach improves reliability by allowing defective components to be identified and replaced without discarding the entire system, thus increasing overall system yield.
Solution Approach 2:
The modular design with reusable active electronics module allows the system to recover and reuse expensive electronic components when the neural interface probe fails or needs upgrading. This recovers investment and improves effective yield by separating disposable sensing elements from reusable electronics.
3Ease of operation
If standard connector is used for neural interface, then ease of operation is improved, but channel density is limited to about 32 channels
Solution Approach 1:
The patent transitions from planar connector designs to a three-dimensional flexible printed circuit board configuration. This dimensional change allows for higher channel density by utilizing the flexible substrate's ability to bend and fold, enabling more connection points in a compact space while maintaining ease of connection through the FPC's flexible nature.
Solution Approach 2:
The use of flexible printed circuit boards as connectors enables high channel density by utilizing the flexibility and thin-film nature of the FPC. The flexible substrate can be configured in compact three-dimensional arrangements that accommodate many more channels than rigid standard connectors, while still providing ease of connection through its flexible properties.
Data Source
AI summary
A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.