Modular Optical Packaging With Detachable Fiber Assembly
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Solution Overview
Problem
High-speed optical modules face challenges such as capacitance, impedance mismatches, electromagnetic interference, size constraints, and difficulty in testing, replacing, or repairing components without damaging others, which hinder the development of higher speed and density optical transceivers and transponders.
Innovation Solution
The implementation of a modular optical packaging system with a detachable fiber assembly and ball grid array (BGA) connections allows for easy removal and replacement of optical components, such as TOSA and ROSA, without damaging the fiber assembly, enabling component-level evaluation and repair, and facilitating higher connection density and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are tightly integrated to reduce module size, then size constraints are satisfied, but difficulty in testing and replacing components increases
Solution Approach 1:
The optical module is divided into separable components including the optical component, fiber assembly, and housing. The fiber assembly can be detached from the optical component, allowing the optical component to be tested and replaced independently without removing the entire module assembly.
Solution Approach 2:
The fiber assembly is extracted as a separate detachable component from the optical component. This extraction enables the optical component to be accessed, tested, and replaced while leaving the fiber assembly intact, solving the problem of component replaceability in compact modules.
2Device complexity
If conventional connection methods are used to maintain simplicity, then device complexity is low, but electromagnetic interference and impedance mismatches increase at high speeds
Solution Approach 1:
A detachable fiber assembly with receptacle serves as an intermediary between external fibers and the optical component. This intermediary structure provides controlled optical coupling while isolating the high-speed electrical components from electromagnetic interference, enabling high-speed operation with reduced EMI.
3Reliability
If the entire module is replaced instead of individual components, then component damage is avoided, but loss of time and cost increase
Solution Approach 1:
The module architecture segments the optical component from the fiber assembly and housing, allowing selective replacement of only the optical component when defective. This eliminates the need to replace the entire module, reducing time and cost while protecting other components from damage during replacement operations.
4Speed
If high speed data rates are implemented, then data transfer capability improves, but capacitance and impedance mismatches worsen
Solution Approach 1:
The fiber assembly is extracted as a separate component with its own receptacle, isolating the high-speed optical signals from the electrical circuitry. This extraction reduces parasitic capacitance and impedance mismatches by separating the optical and electrical domains, enabling higher data rates with better signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the creation of high-density optical modules with increased signal density, reduced electromagnetic interference, and improved component protection, enabling easier maintenance and cost-effective production of high-speed optical transceivers and transponders with adaptable form factors.
Implementation Method 1
the optical component is heated such that a ball grid array connection, that connects the optical component to a high speed printed circuit board, flows
Data Source
AI summary
Methods of packaging a high density optical module. In one example embodiment, a method of packaging the high density optical module includes various acts. First, a first detachable fiber assembly is connected to an optical component disposed in the module such that the connection between the fiber assembly and the optical component is disposed inside a housing of the optical module. Next, the fiber included in the fiber assembly is spooled around a spooling assembly. Then, the receptacle is secured in a receptacle holder such that the receptacle is able to connect with an external fiber connector. Next, the fiber assembly is detached from the optical component. Finally, the optical component is heated such that a ball grid array connection, that connects the optical component to a high speed printed circuit board, flows such that the optical component can be removed from the high speed printed circuit board.