Modular Output Manifold for Heat Recovery Steam Generators
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Solution Overview
Problem
High cycling heat recovery steam generator systems experience increased component wear and reduced manifold life due to thermal stress, leading to higher initial and replacement costs, as existing output manifolds are often designed with a single output line that requires replacement upon wear or failure.
Innovation Solution
A modular output manifold design featuring an output line connected to two collection lines through a connecting junction, allowing for distributed fluid flow management, which reduces thermal stress and enables component maintenance without replacing the entire manifold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single output line is used to receive fluids from multiple header lines, then the manifold structure is simple, but the component wear increases and the entire manifold must be replaced upon failure
Solution Approach 1:
The patent divides the single output line into multiple collection lines (first collection line, second collection line, etc.), each serving specific header lines. This segmentation allows individual collection lines to be replaced independently when worn, rather than replacing the entire manifold system, thus improving reliability while maintaining reasonable structural complexity.
2Productivity
If a single output line is sized for the entire system capacity, then the flow capacity is sufficient, but the diameter, thickness, and material requirements increase initial and replacement costs
Solution Approach 1:
The patent segments the total flow capacity requirement across multiple collection lines, each sized for a portion of the system's header lines. This allows each collection line to have smaller diameter, thickness, and material requirements compared to a single line handling the entire capacity, thereby reducing manufacturing costs while maintaining sufficient total flow capacity through the parallel configuration.
Solution Approach 2:
The patent transitions from a single-dimensional flow path (one output line) to a multi-dimensional parallel flow path structure (multiple collection lines). This dimensional change allows the system to achieve the same total flow capacity with smaller individual components, reducing material requirements and manufacturing costs.
3Reliability
If the entire manifold is replaced upon wear or failure, then system reliability is restored, but the replacement cost and downtime increase
Solution Approach 1:
The patent segments the manifold into independent collection lines that can be replaced individually. When one collection line wears or fails, only that specific line needs to be replaced rather than the entire manifold, significantly reducing replacement time and downtime while restoring system reliability.
Solution Approach 2:
The patent creates a dynamic replacement strategy where collection lines can be replaced on-demand based on their individual wear conditions, rather than replacing the entire system on a fixed schedule or upon any single failure. This allows for more flexible and efficient maintenance operations.
4Device complexity
If header lines are connected directly to a single output line, then the manifold structure is simple, but thermal stress concentrates and increases component wear
Solution Approach 1:
The patent segments the thermal stress distribution by introducing multiple collection lines between the header lines and the output line. Each collection line carries a portion of the thermal load, distributing the thermal stress across multiple components rather than concentrating it in a single line, thereby reducing component wear and extending lifespan.
Data Source
AI summary
This disclosure provides manifolds, manifold components, and heat recover steam generator systems. An output line of an output manifold is fluidically connected to at least one downstream process. A first collection line is fluidically connected to a plurality of header lines by a first set of header links. A second collection line is fluidically connected to the plurality of header lines by a second set of header links. A connecting junction fluidically connects the first collection line and the second collection line to the output line.