Modular Microelectronic Package With Self-Aligning Hermetic Sealing

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Solution Overview

Problem

Existing microelectronic package structures require precise stacking and specific tooling, leading to high manufacturing costs and long design-to-manufacturing times, especially for hermetic and ceramic packages, which are not cost-effective for small volumes.

Innovation Solution

A modular microelectronic package design using mating portions with grooves and ridges for alignment and adhesive sealing, allowing for cost-effective production in smaller volumes and reducing design time, with a connection system that includes grooves and adhesive applied along the mating portions to join modular elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If precise stacking and specific tooling are used to manufacture hermetic and ceramic packages, then manufacturing precision and reliability are improved, but manufacturing cost increases and productivity decreases

Engineering Contradiction:

Improvestacking precisionVSAvoidmanufacturing volume efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The package structure is divided into separate modular elements (substrate, cavity structure, lid) that can be manufactured independently using standard PCB and enclosure fabrication processes, then assembled together. This segmentation eliminates the need for expensive multi-layer ceramic stacking tooling while maintaining hermetic sealing through adhesive bonding and sealing structures.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If precise stacking and specific tooling are used to manufacture hermetic and ceramic packages, then manufacturing precision is improved, but device complexity and manufacturing time increase

Engineering Contradiction:

Improvealignment precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The modular elements incorporate self-aligning features such as recesses, protrusions, and sealing structures that automatically guide proper positioning during assembly. The adhesive bonding process itself provides alignment tolerance, eliminating the need for complex external alignment tooling while ensuring precise relative positioning of components.

Inventive Principle:

Principle #25Self-service

3Reliability

If traditional hermetic and ceramic package structures are used, then hermetic sealing is achieved, but manufacturing cost increases for small volumes

Engineering Contradiction:

Improvehermetic sealingVSAvoidmanufacturing cost efficiency

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention transitions from high-temperature ceramic firing processes to lower-temperature adhesive bonding processes. Standard PCB substrates and enclosure materials are used instead of expensive hermetic ceramics, while adhesive formulations and sealing structures provide sufficient hermetic protection for the application requirements at a fraction of the cost.

Inventive Principle:

Principle #35Parameter changes

4Strength

If modular elements are stacked and attached with precise alignment, then structural integrity is improved, but specific tooling requirements increase manufacturing cost

Engineering Contradiction:

Improvestructural integrityVSAvoidtooling cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

Alignment features such as recesses, protrusions, and positioning structures are pre-formed as integral parts of the modular elements during their respective fabrication processes. This preliminary preparation of alignment features eliminates the need for expensive external alignment tooling during assembly, while ensuring consistent structural integrity through repeatable positioning.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular structure facilitates efficient production of hermetic packages in smaller volumes, reducing the need for specific tooling and design time, while providing hermetic sealing and alignment, suitable for harsh environments.

Implementation Method 1

an adhesive applied along the mating portions

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

mating portions of the respective modular elements, which extend around the cavity and mate with each other

Methodology Applied

Scientific EffectMechanical alignment: Mechanical Fastener

Data Source

PatentUS20250379110A1Microelectronic package and electronic device comprising such microelectronic package

Publication Date: 2025.12.11 CERCUITS

AI summary

A microelectronic package comprising a stack of modular elements which together form an enclosure with a cavity inside for holding a microelectronic device, wherein the stack of modular elements comprises, for at least two modular elements of the stack, a connection system that joins the respective modular elements to each other, wherein the connection system is formed by mating portions of the respective modular elements, which extend around the cavity and mate with each other, and an adhesive applied along the mating portions.