Modular Package Substrate for Semiconductor Pin Compatibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor device packaging solutions often require separate designs for different customer compatibility requirements, leading to inefficiencies and reduced cross-compatibility, even when functional specifications are identical.
Innovation Solution
A semiconductor device assembly that includes a package-level substrate with adaptable contact pads, allowing for an additional package-level substrate to alter compatibility by reconfiguring external connections without changing the packaged device's internal layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate package designs are created for different customer compatibility requirements, then compatibility with specific host devices is improved, but device complexity and design time increase
Solution Approach 1:
The package substrate is divided into a first substrate carrying the semiconductor die and a second substrate that can be selectively coupled to the first substrate. This segmentation allows the second substrate to be configured differently for different compatibility requirements while keeping the core packaged device unchanged, thus improving adaptability without significantly increasing overall design complexity.
Solution Approach 2:
The package substrate system is made dynamic by allowing optional coupling of the second substrate. The configuration can be changed by adding or removing the second substrate depending on the specific compatibility requirements, enabling the same packaged device to adapt to different host devices without requiring multiple fixed designs.
2Adaptability or versatility
If separate package designs are created for different customer compatibility requirements, then compatibility with specific host devices is improved, but manufacturing efficiency decreases
Solution Approach 1:
By segmenting the package substrate into modular first and second substrates, the manufacturing process can produce the first substrate with the semiconductor die in a standardized manner, then selectively add the second substrate for different compatibility configurations. This modular approach maintains high manufacturing efficiency for the core component while enabling customization for different customers.
Solution Approach 2:
The first substrate with the semiconductor die is prepared in advance with standardized interfaces and bond pads. This preliminary preparation allows for efficient bulk manufacturing of the core packaged device, while the second substrate can be selectively added later to meet specific compatibility requirements without reworking the entire manufacturing process.
3Adaptability or versatility
If the package substrate configuration is changed to alter compatibility, then adaptability to different host devices is improved, but the internal layout of the packaged device must be modified
Solution Approach 1:
The package substrate is segmented into a first substrate that maintains the stable internal layout with the semiconductor die, and a second substrate that handles compatibility configurations. This segmentation isolates the internal layout from changes, allowing the second substrate to be modified or added without affecting the stability of the core packaged device's internal structure.
Solution Approach 2:
The second substrate acts as an intermediary between the stable internal layout of the first substrate and the external host device requirements. It provides the necessary interface adaptations for different compatibility configurations while leaving the internal layout of the packaged device unchanged, thus maintaining stability while improving adaptability.
Data Source
AI summary
This document discloses techniques, apparatuses, and systems relating to a package substrate for a semiconductor device. A semiconductor device assembly is described that includes a packaged semiconductor device having one or more semiconductor dies coupled to a package-level substrate. The package-level substrate has a first surface at which first contact pads are disposed in a first configuration. The packaged semiconductor device is coupled with an additional package-level substrate that includes a second surface having second contact pads disposed in the first configuration and a third surface having third contact pads disposed in a second configuration different from the first configuration. The additional package-level substrate includes circuitry coupling the second contact pads the third contact pads to provide connectivity at the third contact pads. In doing so, an adaptively compatible semiconductor device may be assembled.