Modular PCB Carrier for Uniform Underfill on Large Boards
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Solution Overview
Problem
The underfill process for large and oddly shaped circuit boards is challenging due to difficulty in accessing components and applying consistent heat for capillary action, which is essential for underfill distribution and crosslinking.
Innovation Solution
A modular carrier system with an outer frame and removable insets supports large circuit boards during underfill, utilizing robotic arms and overhead heaters to apply heat and underfill evenly, with controlled heating and indexing to ensure complete coverage and capillary action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional underfill processes are used for large circuit boards, then the underfill can flow under components via capillary action, but it becomes difficult to access components and apply consistent heat for large and oddly shaped boards
Solution Approach 1:
The system segments the heating function into multiple overhead heating zones that can independently heat different regions of large circuit boards. This allows consistent heat application across the entire board surface, enabling reliable capillary action for underfill distribution even on large and oddly shaped boards where traditional localized heating would be insufficient.
Solution Approach 2:
The system transitions from localized side-heating to overhead heating, adding a vertical dimension to heat application. This dimensional change allows heat to be applied uniformly across the entire board surface from above, making the process independent of board size and shape, and improving both heat consistency and component accessibility.
2Adaptability or versatility
If the circuit board size increases, then more components can be placed on the board, but it becomes difficult to access components for underfilling and apply consistent heat
Solution Approach 1:
The overhead heating system serves multiple functions: it heats large boards uniformly, maintains temperature during underfill distribution, and works with various board shapes and sizes. This universal heating approach eliminates the need for specialized heating equipment for different board configurations, achieving both adaptability and manufacturing precision.
Solution Approach 2:
The system changes the heating parameters by transitioning from localized, contact-based heating to distributed, overhead radiant heating. This parameter change allows consistent heat application across increasingly large board areas, maintaining thermal uniformity regardless of board size or shape, thereby supporting both adaptability and manufacturing precision.
3Reliability
If overhead heating is used to apply heat uniformly across large boards, then capillary action can be maintained, but the system complexity increases with modular carriers and indexing mechanisms
Solution Approach 1:
The carrier system is segmented into modular components including removable board supports and adjustable positioning elements. This segmentation allows the complex overhead heating system to accommodate various board sizes and shapes while maintaining heat distribution uniformity, as each module can be independently configured for the specific board being processed.
Solution Approach 2:
The carrier system incorporates dynamic indexing mechanisms that automatically position boards in optimal locations under the overhead heating zones. This dynamic positioning capability manages system complexity by automating the coordination between board placement and heat application, ensuring uniform heat distribution without requiring manual intervention for each board configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively underfills large circuit boards by ensuring uniform heat distribution and capillary action, enhancing mechanical stability of components on the board.
Implementation Method 1
as underfill is the result, in most processes, of a capillary action by which the underfill flows under the component in the presence of heat
Implementation Method 2
utilizing robotic arms and overhead heaters to apply heat and underfill evenly, with controlled heating and indexing
Data Source
AI summary
An apparatus, system and method for a carrier suitable to carry a circuit board through a semiconductor underfill process. The apparatus, system and method includes a modular carrier capable of supporting a printed circuit board during at least an underfill process, the modular carrier comprising: an outer frame having, at least about a center point thereof, at least one open aspect; and at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board.