Modular PCB Connectors for Scalable Low-Cost Board Assembly
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Solution Overview
Problem
Current integrated circuit design and fabrication face challenges in achieving cost-effective and environmentally sustainable printed circuit board (PCB) solutions that offer design flexibility, scalability, and re-usability, particularly for both compact laptops and large system designs, due to the limitations of conventional manufacturing approaches.
Innovation Solution
The use of modular printed circuit board solutions featuring molded array solder connections (MASC) interposers, which enable cost-efficient connection of discrete PCB units by providing a scalable and flexible PCB assembly method, allowing for 'plug-n-play' options and reduced reflow soldering needs, using conductive materials like silver and copper particles in silicone polymers for electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional board-to-board connectors are used to connect discrete PCB units, then electrical connections are established, but manufacturing cost increases by 30-40%
Solution Approach 1:
The patent merges the connector structure with the PCB units themselves, eliminating separate connector components. The connector is integrated directly into the PCB substrate, creating a unified structure that reduces part count and assembly complexity while maintaining reliable electrical connections between PCB units.
Solution Approach 2:
The patent creates a universal connector design that can be applied across various PCB unit configurations and laptop segments. The same connector architecture serves multiple functions including electrical connection, mechanical alignment, and structural support, reducing the need for specialized connectors for different applications.
2Reliability
If conventional PCB designs are used for laptop systems, then performance requirements are met, but PCB size and component footprint increase
Solution Approach 1:
The patent divides the traditional single large PCB into multiple discrete PCB units that can be connected together. This segmentation allows for more efficient space utilization, as only the necessary functional modules are included in each unit, reducing overall PCB footprint while maintaining system performance.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional stacked configuration using vertical connectors. This dimensional change allows multiple PCB units to be connected in layers, significantly reducing the horizontal footprint while maintaining or enhancing system performance through increased component density.
3Adaptability or versatility
If modular PCB designs are implemented, then design flexibility and re-usability are enhanced, but manufacturing complexity increases due to reflow soldering requirements
Solution Approach 1:
The patent performs preliminary actions by pre-attaching the connector structures to the PCB units during the PCB fabrication process itself. This preliminary integration eliminates the need for separate reflow soldering operations during final assembly, as the connectors are already permanently bonded to the PCB substrates before the units are connected together.
4Productivity
If traditional PCB manufacturing approaches are used, then production processes are standardized, but environmental sustainability is compromised due to soldering waste
Solution Approach 1:
The patent enables discarding of excess solder material that would normally be wasted in conventional reflow soldering processes. By using pre-applied conductive materials that are precisely positioned and transferred during connector attachment, the system recovers material efficiency by minimizing overspray and discarded solder, thereby reducing environmental impact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a 30% to 40% cost reduction compared to traditional board-to-board connectors, enhances design flexibility, and supports environmental sustainability by enabling modular system designs with replaceable components and reduced manufacturing complexity.
Implementation Method 1
a first set of connector openings for providing electrical connections between the at least two printed circuit board units
Data Source
AI summary
According to the various aspects, the present disclosure is directed to printed circuit board assemblies having a plurality of printed circuit board units or modules that use board connectors for joining the printed circuit board units. In an aspect, the board connector has a first surface, which may be a top surface, and an opposing second surface, which may be a bottom surface, and a plurality of openings, including a first set of connector openings for providing electrical connections between the at least two plurality of printed circuit board units. In another aspect, a method that includes forming a first printed circuit board unit with a first connecting portion and a second printed circuit board unit with a second connecting portion, and the first and second connecting are electrically coupled with the printed circuit board connector.