Modular PCB Converter Layout for Heat Dissipation and Replacement

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Solution Overview

Problem

Heat generation during prolonged operation of converters reduces their performance and durability.

Innovation Solution

A power conversion module with a separable structure comprising two printed circuit boards, each with a controller, connected via connectors, and equipped with dedicated heat sink plates for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Duration of action of stationary object

If a converter operates for a long time, then power conversion function is maintained, but heat is generated by electronic elements reducing performance and durability

Engineering Contradiction:
Improveoperating durationVSAvoidheat generation
Core Design Contradiction:
Duration of action of stationary objectVSTemperature

Solution Approach 1:

The converter is divided into two separate printed circuit boards (first PCB and second PCB) that can be independently managed. The first PCB contains heat-generating elements while the second PCB contains control elements. This segmentation allows independent thermal management of each board, enabling the heat-generating components to be replaced or cooled without affecting the entire converter assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Heat-generating electronic elements are extracted from the main control circuitry and placed on a separate first printed circuit board. This extraction allows the heat source to be physically separated from sensitive control components, enabling targeted heat dissipation strategies and component replacement without disrupting the entire system.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of manufacture

If the converter uses an integrated structure, then manufacturing is simplified, but replacement of heat-generating components requires altering the entire module

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcomponent replacement
Core Design Contradiction:
Ease of manufactureVSEase of repair

Solution Approach 1:

The converter architecture is segmented into modular printed circuit boards connected via connectors. The first PCB containing heat-generating elements can be independently removed and replaced by disconnecting connectors, without requiring modification of the second PCB or the entire converter housing. This modular design simplifies repair operations while maintaining manufacturing efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The converter design incorporates detachable connectors that enable dynamic reconfiguration and replacement of printed circuit boards. This dynamic interface allows the first PCB to be easily swapped out for maintenance or upgrading of heat-generating components, transforming a previously static integrated structure into a maintainable modular system.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation performance, improving converter durability and design flexibility by allowing modular replacement of heat-generating components without altering the entire module.

Implementation Method 1

a first heat sink plate 471 disposed on the other surface of the first printed circuit board 431, and a second heat sink plate 461 disposed on the other surface of the second printed circuit board 401

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP3935929B1Converter including printed circuit board and power conversion module including converter
Publication Date: 2025.07.02 SAMSUNG ELECTRONICS CO LTD
  • EP3935929B1 patent drawingFigure 1~2
  • EP3935929B1 patent drawingFigure 3~4

AI summary

The disclosure relates to a communication technique and system after 4G systems for combining a 5G communication system with IoT technology to support higher data rates. Based on 5G communication and IoT-related technologies, the disclosure can be applied to intelligent services (e.g., smart home, smart building, smart city, smart or connected car, healthcare, digital education, retail, security, and safety). A converter may include: a first printed circuit board having a first controller for power conversion disposed on an inner surface of the first printed circuit board, the inner surface of the first printed circuit board comprised in an inner surface of the converter; a second printed circuit board having a second controller for power conversion disposed on an inner surface of the second printed circuit board, the inner surface of the second printed circuit board facing the inner surface of the first printed circuit board and comprised in the inner surface of the converter; first connectors disposed on the inner surface of the first printed circuit board; and second connectors disposed on the inner surface of the second printed circuit board, the second connectors configured to be coupled with the first connectors.