Modular PCB Assembly With Serial Links for Noise Isolation

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Solution Overview

Problem

The increasing complexity of electronic appliances, with added functions, results in larger printed circuit boards due to the mixing of electrical parts with different specifications, leading to noise interference and reliability issues from strong and weak electric fields.

Innovation Solution

A printed circuit board assembly is divided into multiple boards with common and different specification electrical parts, connected through serial communication and insulated to reduce noise and size, using microprocessors on each board and insulation units to manage electric fields and vibrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If all electrical parts (common and specification-specific) are arranged on a single printed circuit board, then all functions can be integrated, but the board size increases making installation difficult

Engineering Contradiction:
Improvefunctional integrationVSAvoidprinted circuit board size
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent divides the printed circuit board into multiple separate boards: a common board containing specification-independent electrical parts (power supply unit, drive unit) and specification boards containing specification-specific electrical parts. This segmentation allows each board to be optimized for its specific function, reducing the overall size required while maintaining full functionality across different appliance specifications.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If strong electric field parts and weak electric field parts share the same printed circuit board, then manufacturing is simplified, but noise interference occurs between the electrical parts

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidnoise interference
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent separates electrical parts into different boards based on their electric field characteristics. The common board hosts power supply and drive units that generate strong electric fields, while specification boards host sensors and control circuits that operate with weak electric fields. This physical separation eliminates noise interference between strong and weak signal areas while maintaining manufacturing efficiency through standardized board designs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each board is designed with local quality optimized for its specific function: the common board is designed to handle high-power components with appropriate grounding and shielding, while specification boards are designed for low-power sensitive components. This localized optimization ensures each board performs its function reliably without being compromised by incompatible electrical characteristics.

Inventive Principle:
Principle #3Local quality

3Device complexity

If multiple electrical parts are arranged on a single board to reduce component count, then assembly is simplified, but the board becomes delicate to noise and reliability deteriorates

Engineering Contradiction:
Improvecomponent countVSAvoidnoise susceptibility
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

Instead of crowding all components onto one board, the patent segments them into functionally-related groups on separate boards. The common board contains the power supply unit and drive unit that require robust noise immunity, while specification boards contain sensors and control circuits that generate and process sensitive signals. This segmentation reduces noise susceptibility while the inter-board connections maintain system integration, achieving both reliability and manageable complexity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8130510B2Printed circuit board assembly of electronic appliance
Publication Date: 2012.03.06 SAMSUNG ELECTRONICS CO LTD
  • US8130510B2 patent drawing
  • US8130510B2 patent drawing
  • US8130510B2 patent drawing

AI summary

Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electronic appliance. The printed circuit board assembly is divided into a plurality of boards, such that electrical parts having a common specification and electrical parts having different specifications are arranged on different boards, thereby optimizing the printed circuit board assembly and configuring the boards according to the specification of the electronic appliance without loss. Microprocessors are arranged on the boards, and the boards are connected to each other in a serial communication, thereby reducing the number of wiring harnesses (W/H) and thus configuring the printed circuit board assembly with high reliability. Furthermore, the boards are connected to each other in an insulation manner, thereby configuring the boards in an anti-resistance structure.