Modular Periphery Tiles for FPGA Shoreline Scalability
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Solution Overview
Problem
Integrated circuit devices, such as FPGAs, face reduced scalability and performance due to limited shoreline space, leading to design compromises and increased costs in including periphery IP, which restricts customization and silicon yield.
Innovation Solution
Disaggregating periphery IP into modular tiles that can be independently designed and fabricated, allowing for standardized interfacing with programmable fabric dies via silicon interposers, enabling customization and improved scalability without impacting connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If periphery IP is placed on the shoreline of the programmable fabric, then device functionality is improved, but shoreline space is consumed leading to reduced scalability
Solution Approach 1:
The periphery IP is segmented into modular tiles that can be independently placed and configured. Each tile represents a discrete functional unit (e.g., memory interface, I/O block) that can be selectively instantiated based on design requirements, allowing functionality to be added without requiring continuous shoreline placement.
Solution Approach 2:
The patent transitions from two-dimensional shoreline placement to three-dimensional stacking architecture. Periphery IP tiles are placed in vertical layers above and below the programmable fabric, utilizing the Z-dimension to expand available space without consuming additional shoreline area.
2Reliability
If more periphery IP is included around the shoreline, then device performance is improved, but design complexity and costs increase
Solution Approach 1:
The periphery IP tiles are designed with universal interfaces and standardized connection protocols that allow the same tile types to be reused across different device configurations. This modularity reduces design complexity by eliminating the need to create custom interfaces for each periphery component.
Solution Approach 2:
Identical or similar periphery IP functionality is copied across multiple tiles rather than redesigning each instance. The modular tile architecture allows replication of proven designs, reducing verification costs and design complexity while maintaining consistent performance across multiple instances.
3Adaptability or versatility
If periphery IP is disaggregated into modular tiles, then scalability is improved, but interface standardization requirements increase
Solution Approach 1:
A universal interface standard is established for all periphery IP tiles, allowing any tile type to connect to the programmable fabric and other tiles using the same protocol. This enables unlimited scalability while managing interface complexity through standardization rather than proliferation of unique interfaces.
4Productivity
If modular periphery tiles are used, then silicon yield is improved, but fabrication process complexity increases
Solution Approach 1:
The chip is segmented into separately fabricable modules (programmable fabric and periphery IP tiles) that can be manufactured independently and then assembled. This allows each module to be optimized for its specific fabrication requirements and enables replacement of defective modules without scrapping the entire chip, improving silicon yield.
Data Source
AI summary
Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.