Modular Phased Array Reducing Signal Loss via Local RF Generation

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Solution Overview

Problem

Conventional phased arrays face challenges with signal losses and impedance mismatch issues due to the distribution of high-frequency RF signals over corporate feed networks, leading to costly manufacturing requirements for maintaining low-loss and well-controlled impedance components.

Innovation Solution

The modular phased array system localizes the generation and down-conversion of RF signals near each antenna, using a local oscillator (LO) signal and intermediate frequency (IF) signals distributed through corporate feed or bidirectional signaling networks, eliminating the need for extensive RF signal distribution across the array and reducing the stringent electrical requirements for connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high-frequency RF signals are distributed over corporate feed networks to all antennas, then phased array operation is achieved, but signal losses and impedance mismatch issues occur

Engineering Contradiction:
Improvesignal qualityVSAvoidsignal loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent divides the phased array into multiple independent modules, where each module contains its own RF signal generation and distribution network. This segmentation isolates the RF signal paths, preventing signal losses and impedance mismatch issues from affecting the entire array, as each module operates independently with its own corporate feed network.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local RF signal generation and distribution within each module, allowing each module to maintain optimal signal quality independently. The local corporate feed networks are designed with appropriate impedance control and signal conditioning specific to each module's requirements, rather than relying on a single centralized RF distribution system.

Inventive Principle:
Principle #3Local quality

2Reliability

If corporate feed networks are designed to maintain low-loss and well-controlled impedance, then signal quality is preserved, but manufacturing costs increase

Engineering Contradiction:
Improvesignal qualityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the large phased array into multiple smaller modules, each with its own corporate feed network. This allows each module to use simpler, less expensive transmission line designs and impedance control measures, while still achieving the required overall signal quality. The reduced size of each module's RF network lowers manufacturing complexity and cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent accepts that each module's RF components may have limited precision compared to a fully integrated system, but this is acceptable given the modular architecture. Each module can be manufactured with standard, cost-effective components, and any performance variations are compensated through the phased array's beamforming capabilities rather than requiring expensive precision components throughout.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If RF signals are distributed extensively across the array, then all antennas receive synchronized signals, but connector electrical requirements become more stringent

Engineering Contradiction:
Improvesignal synchronizationVSAvoidconnector requirements
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the phased array into multiple modules, with each module having its own RF signal distribution network. This segmentation reduces the electrical length and complexity of the transmission paths within each module, allowing the use of simpler connectors with less stringent electrical requirements. Each module's connectors only need to handle signals for that specific module, not the entire array.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local RF signal generation and distribution within each module, allowing each module to have optimized connector designs specific to its size and signal requirements. Rather than requiring all connectors throughout the array to meet the most stringent electrical specifications, each module's connectors are designed for its specific needs, reducing overall complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces signal losses and impedance mismatch issues, simplifies the design, and lowers manufacturing costs by allowing the use of less expensive connectors and circuit board components, while maintaining effective phase and amplitude control for steering radiation patterns.

Implementation Method 1

an up-converter to mix the IF signal and a signal derived from the local oscillator (LO) to generate an RF signal

Methodology Applied
Scientific EffectMixing: Heterodyne

Implementation Method 2

a down-converter to mix an RF signal received by the antenna with a signal derived from the local oscillator (LO) to generate a received IF signal

Methodology Applied
Scientific EffectMixing: Heterodyne

Data Source

PatentEP3326242B1A modular phased array
Publication Date: 2022.03.02 BLUE DANUBE SYSTEMS INC
  • EP3326242B1 patent drawingFigure 1A~1B
  • EP3326242B1 patent drawingFigure 2A~2B
  • EP3326242B1 patent drawingFigure 3

AI summary

A removable module for a phased array, the module including: a circuit board having a ground plane formed on one side of the circuit board; an antenna mounted on and extending away from a topside of the circuit board; circuitry on a backside of the circuit board, the circuitry including an RF front end circuit coupled to the antenna; and a group of one or more first connecters mounted on the backside of the circuit board, the first connectors for physically and electrically connecting and disconnecting the module from a master board through a corresponding group of one or more matching second connectors on the master board, the first connectors on the module having electrically conductive lines for carrying an externally supplied LO signal for the RF front end circuit and an IF signal for or from the RF front end circuit.