Modular Photoelectric Substrate Layout for Custom-Size Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic device manufacturing processes are inflexible and costly, requiring different thin-film substrates and manufacturing processes for products of varying sizes or functions, which limits product diversity and increases production expenses.
Innovation Solution
The electronic device comprises a sustaining layer, multiple substrates, photoelectric units, and signal layers, arranged in a flexible joint configuration that allows for easy customization of product size by tiling substrates, reducing the need for multiple manufacturing processes and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different thin-film substrates and manufacturing processes are used for products of varying sizes or functions, then product customization is achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent divides the display device into multiple independent substrates (first substrate, second substrate, third substrate, fourth substrate) that can be manufactured separately using the same TFT process and then assembled together. This segmentation allows standardization of manufacturing processes while achieving product customization through different combinations and arrangements of substrates.
Solution Approach 2:
The patent creates a universal manufacturing platform where the same TFT substrate manufacturing process can produce multiple types of substrates (display substrates, touch substrates, sensing substrates) that can be combined in various configurations to create different product sizes and functions, eliminating the need for separate manufacturing processes for each product type.
2Adaptability or versatility
If different thin-film substrates and manufacturing processes are used for products of varying sizes or functions, then product customization is achieved, but production costs increase
Solution Approach 1:
By segmenting the display device into multiple substrates that can be manufactured using the same standardized TFT process, the patent enables economies of scale in substrate production. The modular approach allows for efficient batch manufacturing of identical substrates that can then be assembled into different product configurations, reducing per-unit costs compared to custom manufacturing for each product size.
Solution Approach 2:
The patent achieves product customization through parameter changes in the assembly configuration (number of substrates, their arrangement, and connections) rather than through changes in the manufacturing process parameters. This allows the same manufacturing process to produce substrates for different product sizes and functions, significantly reducing production costs.
3Adaptability or versatility
If multiple manufacturing processes are used for different product sizes, then product diversity is achieved, but manufacturing flexibility is reduced
Solution Approach 1:
The patent segments the display system into standardized substrate modules that can be manufactured through a single TFT process. These modular substrates can be easily assembled, disassembled, and reconfigured to create different product sizes and functions, thereby enhancing manufacturing flexibility while maintaining product diversity.
Solution Approach 2:
The patent enables dynamic reconfiguration of display devices by using multiple substrates that can be connected or disconnected based on product requirements. This dynamic assembly approach allows the manufacturing system to quickly adapt to different product specifications without changing the fundamental manufacturing process, thereby improving manufacturing flexibility.
Data Source
AI summary
An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, and multiple signal layers. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units.