Modular Photonic Subcircuit Assembly for Precise PIC Alignment

Solution Overview

Problem

The production of application-specific photonic integrated circuits (PICs) is time-consuming and expensive due to the need for precise alignment of multiple degrees of freedom during chip-to-chip attachment, which is difficult to scale up using traditional wafer-scale fabrication methods.

Innovation Solution

The development of modular photonic integrated subcircuits that are pre-fabricated and standardized for efficient assembly, allowing for alignment using complementary alignment features and receptacles, enabling quick and cost-effective integration into larger photonics assemblies with high coupling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional wafer-scale fabrication methods are used for chip-to-chip attachment, then precise alignment of multiple degrees of freedom can be achieved, but the production process becomes time-consuming and expensive

Engineering Contradiction:

Improvealignment precisionVSAvoidproduction speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The photonic integrated circuit is divided into multiple modular subcircuits that can be independently fabricated and then assembled. This segmentation allows each subcircuit to be pre-aligned and tested separately, reducing the overall alignment complexity and time for the complete device while maintaining precise alignment through standardized interfaces between modules.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If traditional wafer-scale fabrication methods are used for chip-to-chip attachment, then precise alignment of multiple degrees of freedom can be achieved, but the cost increases significantly

Engineering Contradiction:

Improvealignment precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The photonic integrated circuit is divided into multiple modular subcircuits that can be independently fabricated and then assembled. This segmentation allows each subcircuit to be pre-aligned and tested separately, reducing the overall alignment complexity and time for the complete device while maintaining precise alignment through standardized interfaces between modules.

Inventive Principle:

Principle #1Segmentation

3Reliability

If traditional wafer-scale fabrication methods are used, then integrated photonics can be produced, but the process is difficult to scale up

Engineering Contradiction:

Improveintegration qualityVSAvoidscalability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The photonic integrated circuit is divided into multiple modular subcircuits that can be independently fabricated and then assembled. This segmentation allows each subcircuit to be pre-aligned and tested separately, reducing the overall alignment complexity and time for the complete device while maintaining precise alignment through standardized interfaces between modules.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention employs universal alignment features and standardized interfaces that can be used across different subcircuit modules. This universality allows the same alignment and assembly processes to be applied repeatedly for different device configurations and scales, enabling easy scaling from small to large photonic integrated circuits without requiring new alignment methodologies for each size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces production time from months to days and significantly lowers costs by enabling modular assembly, improving yield, and allowing for flexible reconfiguration and scalability of PICs.

Implementation Method 1

Each subcircuit can be configured to transfer light to and receive light from another subcircuit... Light can be transferred from the output port to the input port with a coupling efficiency greater than 90%

Methodology Applied

Scientific EffectOptical coupling: Waveguide (optics)

Data Source

PatentUS12554084B2Integrated photonics assemblies

Publication Date: 2026.02.17 SIPHOX INC

AI summary

Disclosed herein are integrated photonics assemblies, circuits, systems and methods therefor. The systems can include a first integrated photonics assembly having a first functionality, in which the first assembly includes a plurality of modular photonic integrated subcircuits. Each subcircuit can be pre-fabricated and can be configured to transfer light to and receive light from another subcircuit based on the first functionality. An output port of a first subset of the subcircuits can be configured to be aligned with an input port of a second subset of the subcircuits. At least one subcircuit can be configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality. The first integrated photonics assembly can be different from the second integrated photonics assembly and the first functionality can be different from the second functionality.