Modular Piezoelectric Sensor Array with Co-Integrated Electronics
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Solution Overview
Problem
Existing sensor array technologies for medical and non-destructive evaluation face challenges with interconnection complexity, parasitic capacitance, and acoustic performance due to limitations in flex circuit manufacturing, high temperature attachment methods, and monolithic construction, which compromise axial resolution and acoustic performance.
Innovation Solution
A modular ultrasound system with co-integrated high sensitivity and wide bandwidth piezoelectric arrays and ASICs, utilizing a conducting interposer for direct electrical interfaces and acoustic attenuation, along with a gimbal system for alignment, and a method for manufacturing that includes low-temperature attachment to prevent material degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flex circuits are used to interconnect transducer arrays to electronics, then the system can be assembled, but parasitic capacitance increases and manufacturing precision is limited by trace and space width constraints
Solution Approach 1:
The patent removes the flex circuit intermediary entirely, extracting the harmful parasitic capacitance from the system. Transducers are laminated directly to ASICs using anisotropic conductive film, eliminating the flex circuit traces that generate parasitic capacitance while maintaining electrical connection capability.
Solution Approach 2:
The patent introduces anisotropic conductive film (ACF) as a new intermediary material between transducers and ASICs. This ACF serves as both the mechanical bonding layer and the electrical interconnect, replacing the problematic flex circuit while providing controlled electrical pathways with minimal parasitic capacitance.
2Object-affected harmful factors
If transducers are laminated directly to ASICs with intervening flex or ACF, then parasitic capacitance is reduced, but ASIC must be thinned from 500 um to less than 50 um which compromises axial resolution through ringing
Solution Approach 1:
The patent changes the thickness parameter of the ASIC from 500 um to less than 50 um to enable direct lamination with transducers. This parameter change reduces the acoustic path length through the ASIC, minimizing ringing effects that would otherwise compromise axial resolution while allowing direct electrical connection.
Solution Approach 2:
The patent uses anisotropic conductive film as a composite material that provides both mechanical bonding and electrical connection functions. This composite approach allows thin ASIC construction without direct mechanical contact between transducer mounting structures and ASIC, reducing acoustic ringing while maintaining electrical connectivity.
3Reliability
If high temperature attachment methods such as bump-bonding solder attach or ACF bonding are used, then electrical connection is achieved, but piezoelectric composites and single crystal materials become warped or de-poled
Solution Approach 1:
The patent changes the temperature parameter of the attachment process from high temperature (solder bonding, ACF curing) to low temperature (<100°C). This parameter change prevents thermal damage to temperature-sensitive piezoelectric materials including composites and single crystals, avoiding warping and de-poling while achieving reliable electrical connections through the ACF.
4Device complexity
If monolithic methods build transducers directly on top of ASICs, then integration is maximized, but acoustic performance is compromised and dedicated fabrication lines are required
Solution Approach 1:
The patent segments the ultrasound system into separate functional modules: transducer arrays, ASICs, and interconnecting ACF layers. This segmentation allows each component to be optimized independently (transducers for acoustic performance, ASICs for electronics) while maintaining high integration through direct lamination, avoiding the acoustic compromises of monolithic construction.
Solution Approach 2:
The patent introduces ACF as an intermediary layer that enables high integration without direct contact between transducer substrates and ASICs. This intermediary allows acoustic energy to pass through the bonding interface with minimal interference, preserving acoustic performance while achieving monolithic-level integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient interconnection, reduced parasitic capacitance, and improved acoustic performance without compromising axial resolution, allowing for advanced beamforming and high-yield production of large area ultrasound arrays.
Implementation Method 1
a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays
Implementation Method 2
each of the one or more transducer arrays includes a plurality of piezoelectric elements
Data Source
AI summary
A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.