Modular High-Frequency Plasma Source for Uniform Large-Substrate Processing

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Solution Overview

Problem

Existing high-frequency radiation systems for plasma processing, such as those using a single antenna, face limitations in geometry matching, plasma uniformity, and tunability, especially for larger substrates, leading to non-uniform processing and difficulty in accommodating substrate nonuniformity.

Innovation Solution

A modular high-frequency emission source comprising an array of modules, each with an oscillator, amplification, and applicator, allowing for spatially tunable and non-contaminating plasma generation, with independent power control and feedback loops for enhanced plasma uniformity and density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a single large high-frequency source and waveguide are used, then high-power plasma generation is achieved, but the system size becomes large and geometry matching with substrate becomes difficult

Engineering Contradiction:
Improveplasma generation powerVSAvoidsystem size and geometry matching
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The invention divides a single large high-frequency source into multiple smaller high-frequency sources (e.g., multiple magnetrons or solid-state amplifiers) that can be independently controlled. These segmented sources are distributed across the processing chamber, allowing each to independently generate plasma in its local region. This segmentation enables better geometry matching with substrates of various sizes and shapes while maintaining high total power output for plasma generation.

Inventive Principle:
Principle #1Segmentation

2Power

If waveguides and associated components are used to transmit high-frequency radiation, then power transmission is achieved, but the system becomes large and design flexibility is severely limited

Engineering Contradiction:
Improvehigh-frequency power transmissionVSAvoiddesign flexibility and geometry matching
Core Design Contradiction:
PowerVSAdaptability or versatility

Solution Approach 1:

The invention extracts and eliminates the waveguide transmission path from the system by placing high-frequency sources directly within or near the processing chamber. This removal of the waveguide enables flexible positioning of multiple small sources throughout the chamber volume, allowing direct coupling of high-frequency energy to the plasma without the geometric constraints and size limitations imposed by waveguide infrastructure.

Inventive Principle:
Principle #2Taking out (Extraction)

3Device complexity

If a single antenna is used for plasma generation, then simplified system structure is achieved, but plasma uniformity across large substrates deteriorates

Engineering Contradiction:
Improvesystem structure simplicityVSAvoidplasma uniformity across substrate
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The invention implements local quality by enabling independent control of multiple distributed high-frequency sources, where each source can be individually adjusted to optimize plasma generation in its specific local region. This allows compensation for edge effects and non-uniformities across large substrates by varying the power and positioning of individual sources, achieving uniform plasma distribution throughout the entire processing area.

Inventive Principle:
Principle #3Local quality

4Area of stationary object

If slot line antenna is used to spread high-frequency energy, then extended surface coverage is achieved, but system complexity increases and power density coupling to plasma is limited

Engineering Contradiction:
Improvesurface coverage areaVSAvoidsystem complexity and power density
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

Instead of using a single complex slot line antenna structure, the invention segments the energy distribution function into multiple independent small sources distributed across the chamber. Each source maintains high power density coupling to plasma locally, while the collective arrangement of multiple sources achieves extended surface coverage. This approach avoids the geometric constraints and complexity of slot line antennas while preserving both high power density and broad coverage.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a more power-efficient, flexible, and uniform plasma generation capable of accommodating larger substrates, with improved power density and ability to adjust for substrate nonuniformity, eliminating interference patterns and reducing system size and complexity.

Implementation Method 1

an output voltage from the voltage control circuit drives oscillation in the voltage controlled oscillator to generate an output high-frequency electromagnetic radiation

Methodology Applied
Scientific EffectElectromagnetic oscillation: Electromagnetic Induction

Implementation Method 2

the amplification module amplifies the output high-frequency electromagnetic radiation from the voltage controlled oscillator

Methodology Applied
Scientific EffectSignal amplification:

Implementation Method 3

a modular high-frequency emission source that is used in a remote plasma processing tool

Methodology Applied
Scientific EffectPlasma generation: Plasma

Data Source

PatentUS12518948B2Remote modular high-frequency source
Publication Date: 2026.01.06 APPLIED MATERIALS INC
  • US12518948B2 patent drawing
  • US12518948B2 patent drawing
  • US12518948B2 patent drawing

AI summary

Embodiments described herein include a processing tool that comprises a processing chamber, a chuck for supporting a substrate in the processing chamber, a dielectric window forming a portion of the processing chamber, and a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source comprises a plurality of high-frequency emission modules. In an embodiment, each high-frequency emission module comprises, an oscillator module, amplification module, and an applicator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, the applicator is positioned proximate to the dielectric window.