Modular Plate Connection System for Semiconductor Test Units

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Solution Overview

Problem

Existing connection systems for test units, such as testing devices and handling devices in semiconductor testing systems, lack flexibility and cost-effectiveness in accommodating various semiconductor elements and test unit geometries, limiting their ability to easily connect and test different types of semiconductor elements.

Innovation Solution

A plate-shaped connection system comprising a master frame with docking elements for releasable connection and an insert frame with mounting elements for test boards, allowing for adjustable distance settings and multiple insert frame configurations to accommodate varying test board geometries, enabling easy switching between different semiconductor elements and test units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single rigid connection system is used for all test units, then structural stability is maintained, but flexibility and adaptability to different semiconductor elements are reduced

Engineering Contradiction:
Improveadaptability to different semiconductor elementsVSAvoidcomplexity of connection system
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The connection system is divided into a master frame and multiple interchangeable insert frames. Each insert frame is designed for specific semiconductor element geometries, allowing the system to adapt to different elements without redesigning the entire connection structure. This segmentation enables modular adaptation while maintaining overall system stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The master frame serves as a universal base structure that can accommodate multiple types of insert frames through standardized connection interfaces. This multi-functionality allows a single master frame to support various semiconductor element types by simply changing the insert frame, achieving versatility without proportional increase in overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple specialized connection systems are designed for different semiconductor elements, then adaptability is improved, but manufacturing cost and device complexity increase

Engineering Contradiction:
Improvecapability to test different semiconductor elementsVSAvoidmanufacturing cost of connection systems
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By segmenting the connection system into a reusable master frame and interchangeable insert frames, the patent enables separate manufacturing optimization. The master frame can be manufactured once at high volume, while insert frames can be manufactured more economically in smaller batches for specific element types, reducing overall manufacturing costs compared to producing multiple complete specialized systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent merges the common functional elements (master frame with docking elements, connection mechanisms) into a single shared structure that serves all semiconductor element types. Only the element-specific portions (insert frames with mounting elements) are differentiated, allowing economies of scale in manufacturing the shared components while maintaining adaptability.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If test boards with varying geometries are used for different semiconductor elements, then testing versatility is improved, but the complexity of mounting and alignment increases

Engineering Contradiction:
Improveversatility in testing different semiconductor elementsVSAvoidease of mounting test boards
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

Each insert frame is designed with local quality optimized for specific test board geometries, featuring mounting elements positioned and configured for particular semiconductor element types. The standardized connection interface between insert frames and master frame maintains uniform operation procedures, allowing operators to switch between different element types by simply changing insert frames rather than learning multiple mounting procedures.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11163000B2Plate-shaped connection system for the connection of two test units, also connection unit and test system each with such a plate-shaped connection system
Publication Date: 2021.11.02 TURBODYNAMICS GMBH
  • US11163000B2 patent drawing
  • US11163000B2 patent drawing
  • US11163000B2 patent drawing

AI summary

The present invention relates to a plate-shaped connection system for the connection of two test units, such as for example a testing device (tester) and a handling device (handler). The handling device serves for the feeding of semiconductor elements to the tester of a test system, for the testing of such semiconductor elements. The plate-shaped connection system comprises a master frame and an insert frame. The master frame is designed for connection with a first of the two test units and one or more docking elements are provided for releasable connection with the other second test unit. The insert frame is designed that it may be connected to the master frame. The insert frame extends inwards from an inner edge of the master frame, wherein the insert frame has mounting elements for the mounting of a test board.