Modular Build Platform Attachment for Throughput and Alignment

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Solution Overview

Problem

Lithography-based additive manufacturing faces challenges in using larger build platforms for supporting and processing 3D objects due to difficulties in handling and post-processing, which can lead to misalignment and reduced accuracy.

Innovation Solution

The use of modular build platforms that are releasably fixed to a carrier, allowing for a larger build area and easier handling during post-processing, with each platform being individually removable and adaptable to specific print jobs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the size of the build platform is increased to allow more objects to be printed simultaneously, then the throughput of the additive manufacturing process is improved, but the ease of handling and post-processing deteriorates

Engineering Contradiction:
ImprovethroughputVSAvoidease of handling
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The build platform is divided into multiple smaller, modular platforms that can be individually handled and processed. Each modular platform maintains the benefits of a large total build area while being small enough for easy manipulation during post-processing operations.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the size of the build platform is increased to allow more objects to be printed simultaneously, then the throughput of the additive manufacturing process is improved, but the manufacturing precision deteriorates due to misalignment

Engineering Contradiction:
ImprovethroughputVSAvoidalignment accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The build platform is divided into multiple smaller, modular platforms that can be individually handled and processed. Each modular platform maintains the benefits of a large total build area while being small enough for easy manipulation during post-processing operations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A carrier serves as an intermediary structure that holds multiple modular build platforms in precise alignment during the printing process. The carrier provides registration features that ensure accurate positioning of each modular platform relative to others, maintaining manufacturing precision while enabling high throughput.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If modular build platforms are used to improve handling during post-processing, then the ease of operation is improved, but the device complexity increases

Engineering Contradiction:
Improveease of handlingVSAvoidsystem complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The modular build platforms are designed with universal features that allow them to be used across different printing scenarios and post-processing operations. The platforms include standardized attachment mechanisms and registration features that work with various carriers and processing equipment, reducing overall system complexity despite the modular architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250276378A1Attachment mechanisms for modular build platforms
Publication Date: 2025.09.04 CUBICURE GMBH
  • US20250276378A1 patent drawing
  • US20250276378A1 patent drawing
  • US20250276378A1 patent drawing

AI summary

Systems, methods, and devices for additive manufacturing are provided. In some embodiments, an assembly for supporting 3D objects during an additive manufacturing process is provided. The assembly can include a plurality of build platforms, each build platform configured to support one or more 3D objects during the additive manufacturing process. The assembly can also include a carrier configured to support the plurality of build platforms. The assembly can further include an attachment mechanism configured to releasably couple the plurality of build platforms to the carrier during the additive manufacturing process such that the plurality of build platforms collectively form a build plane having a vertical deviation no greater than 500 μm.