Modular Data Pod Cooling with Hybrid Free-Cooling Trim
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Solution Overview
Problem
Traditional data center cooling systems are inefficient, requiring large initial and operational costs, and are not adaptable to fluctuating IT loads or high-density data centers, especially in areas with high wet-bulb temperatures.
Innovation Solution
The modular data pod system employs a close-coupled cooling system with a central cooling system, heat exchange assembly, and distributed cooling, using refrigerant-cooled or water-cooled systems that include multiple cooling circuits to efficiently manage heat loads and adapt to varying environmental conditions, reducing the need for mechanical refrigeration and allowing for chiller-less operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional chiller plants are used to cool entire data centers, then cooling capacity is sufficient, but energy efficiency deteriorates significantly when data centers do not run at full power consumption capacity
Solution Approach 1:
The patent divides the data center into multiple modular data pod systems, each with its own cooling system. This segmentation allows each module to be cooled independently according to its actual IT load, rather than cooling the entire data center uniformly. The modular approach enables the cooling capacity to match the actual computational load in each section, improving energy efficiency during partial load operations.
Solution Approach 2:
The patent implements dynamic cooling capacity adjustment by using variable speed condensers and controllable cooling systems in each modular data pod. The cooling capacity can be dynamically adjusted based on the actual IT load and environmental conditions, allowing the system to maintain optimal efficiency across varying operational demands rather than operating at fixed capacity.
2Reliability
If traditional large-scale cooling infrastructures are deployed, then sufficient cooling is provided, but initial capital and operational costs increase
Solution Approach 1:
The patent segments the cooling infrastructure into multiple small modular units, each serving a specific data pod. This eliminates the need for one large centralized chiller plant, reducing both the initial capital investment and operational costs while maintaining adequate cooling coverage through distributed modular units.
Solution Approach 2:
The modular data pod cooling systems are designed as cost-effective, standardized units that can be deployed incrementally. Rather than investing in expensive large-scale infrastructure, the system uses multiple smaller, more economical modular units that can be added as needed, reducing overall infrastructure costs.
3Quantity of substance
If air-cooled free cooling systems are used, then cost is reduced, but operational capability is restricted to cool, dry-climate environments
Solution Approach 1:
The patent designs the modular data pod cooling system with multiple operational modes including free cooling, adiabatic-assisted cooling, and mechanical refrigeration. This multi-functionality allows the same system to operate effectively across diverse geographical climates, from cool dry environments to hot humid conditions, eliminating the geographical restrictions of air-cooled free cooling systems alone.
Solution Approach 2:
The patent introduces adiabatic cooling as an intermediary mechanism between air-cooled free cooling and traditional mechanical refrigeration. The adiabatic-assisted system uses water evaporation to pre-cool air before it enters the data pod, extending the operational range of free cooling systems to warmer climates while maintaining cost-effectiveness.
4Adaptability or versatility
If adiabatic-assisted cooling systems are deployed, then geographical reach is expanded, but cooling capacity becomes insufficient for high density data centers
Solution Approach 1:
The patent combines adiabatic-assisted cooling with mechanical refrigeration systems in a hybrid architecture. The adiabatic system handles the base cooling load and extends geographical capability, while mechanical refrigeration units provide additional cooling capacity when needed for high-density IT equipment, achieving both broad geographical reach and sufficient cooling power.
Solution Approach 2:
The system dynamically adjusts the balance between adiabatic-assisted cooling and mechanical refrigeration based on the actual cooling load and environmental conditions. During low-load periods, the adiabatic system operates independently; during high-load periods in hot climates, mechanical refrigeration supplements the adiabatic cooling to maintain adequate capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides significant cost savings, improved energy efficiency, and scalability, enabling high-density data center operations with reduced mechanical cooling infrastructure and enhanced tolerance for high wet-bulb temperatures, while maintaining efficient cooling even in extreme conditions.
Implementation Method 1
a heat exchange member coupled to the first cooling circuit and configured to cool the electrical equipment
Implementation Method 2
a secondary cooling device configured to cool fluid flowing through the second cooling circuit
Data Source
AI summary
A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.