Modular Pogo Block Contactor for Flexible IC Testing
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Solution Overview
Problem
The existing methods for testing packaged integrated circuits require frequent modifications to printed circuit boards (PCBs) as product families evolve, leading to high costs and time consumption due to changes in package sizes, pin-outs, and types.
Innovation Solution
A test apparatus utilizing a pogo block assembly that can be configured to connect to either a primary PCB or a daughter card PCB, allowing reuse of the base PCB for various package types and sizes, with pogo blocks and alignment plates secured to frames of different thicknesses to accommodate different testing configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If PCB is modified for each product iteration to accommodate different package sizes, pin-outs, and types, then testing capability is improved, but cost and time consumption increase
Solution Approach 1:
The test apparatus is divided into modular components: a base PCB, removable pogo pin assemblies, and interchangeable frames. Each pogo pin assembly can be independently configured and replaced to accommodate different package types, eliminating the need to modify the entire PCB for each product iteration.
Solution Approach 2:
The base PCB is designed with universal mounting structures and electrical connections that can support multiple package types through interchangeable pogo pin assemblies. This multi-functional design allows a single PCB to serve various testing configurations without modification.
2Adaptability or versatility
If PCB is modified for each product iteration to accommodate different package sizes, pin-outs, and types, then testing capability is improved, but cost increases
Solution Approach 1:
The test apparatus is divided into modular components: a base PCB, removable pogo pin assemblies, and interchangeable frames. Each pogo pin assembly can be independently configured and replaced to accommodate different package types, eliminating the need to modify the entire PCB for each product iteration.
Solution Approach 2:
The base PCB is designed with universal mounting structures and electrical connections that can support multiple package types through interchangeable pogo pin assemblies. This multi-functional design allows a single PCB to serve various testing configurations without modification.
3Reliability
If pogo block is configured to connect to primary PCB for testing, then electrical connection is established, but frame thickness must accommodate alignment plate
Solution Approach 1:
The frame thickness is made variable through the use of interchangeable frames with different thicknesses. Each frame thickness is optimized for specific package types, allowing the system to dynamically adapt the frame structure to match the testing requirements while maintaining reliable electrical connections.
Solution Approach 2:
Different frame thicknesses are used in different configurations based on the specific package type being tested. The alignment plate and pogo pin assembly are locally optimized for each package type, ensuring proper contact pressure and electrical connection without unnecessary structural bulk.
Data Source
AI summary
A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.