Modular POL Converter Assembly for High-Density Low-Inductance Power
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Solution Overview
Problem
Conventional power overlay (POL) modules face challenges in achieving high power density and flexibility in configuration due to limitations in interconnection structures and manufacturing processes, which restrict their application in high-power conversion applications.
Innovation Solution
The development of modular power overlay devices with a half-bridge configuration, utilizing a dielectric layer, conductive layers, and semiconductor switching devices, allows for flexible configuration of half-bridge, full-bridge, and three-phase bridge converter circuits by selectively combining modular components, enabling low inductance and high-power density designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional POL modules use traditional interconnection structures and manufacturing processes, then manufacturing simplicity is maintained, but power density and configuration flexibility are limited
Solution Approach 1:
The invention divides the POL module into separate functional layers (power semiconductor devices, conductive layers, dielectric layers, substrate) that can be independently manufactured and then assembled. This segmentation allows each layer to be optimized separately while enabling flexible configuration options (half-bridge, full-bridge, three-phase) without redesigning the entire interconnection structure, thereby increasing power density without proportionally increasing overall complexity.
Solution Approach 2:
The patent transitions from traditional planar interconnection structures to a multi-layer three-dimensional architecture with conductive layers stacked across multiple dielectric layers. This dimensional change enables more efficient power and signal routing, reduces parasitic inductance, and allows higher power density while maintaining manageable complexity through standardized layer interfaces.
2Adaptability or versatility
If conventional POL modules use fixed configuration designs, then manufacturing process simplicity is maintained, but configuration flexibility for different power conversion applications is restricted
Solution Approach 1:
By segmenting the module into standardized functional layers with defined interfaces, the invention enables flexible configuration (half-bridge, full-bridge, three-phase) through selective assembly of layers rather than requiring different manufacturing processes for each configuration. This maintains ease of manufacture through standardized processes while achieving high adaptability.
Solution Approach 2:
The patent creates universal substrate and dielectric layer designs that can support multiple circuit configurations (half-bridge, full-bridge, three-phase) through different device arrangements and conductive layer patterns. This universal base structure enables configuration flexibility without requiring separate manufacturing processes for each application type.
3Adaptability or versatility
If modular components are selectively combined to create different converter circuits, then configuration flexibility and scalability are improved, but assembly complexity increases
Solution Approach 1:
The invention segments the power converter into modular functional units (power semiconductor devices, conductive layers, dielectric layers) with standardized interfaces. This segmentation enables selective combination of modules to create different converter configurations while controlling assembly complexity through consistent interface definitions and standardized assembly procedures.
Solution Approach 2:
The patent combines multiple functional layers (power devices, conductors, dielectrics) into integrated modular units that can be assembled together to form complete converter circuits. This merging approach reduces overall assembly complexity by pre-integrating interconnections within modules while maintaining configurability through selective module combination.
Data Source
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AI summary
A modular POL component (301) can be arranged to define a half-bridge converter topology (25), and can be coupled with other modular POL power components (301) to define a full-bridge or 3-phase AC converter topology (43), (63), based on a desired power output. The assembled POL components (301) can be mounted on a common electrically insulative substrate (325), (425), (725) to define a POL power conversion device (300) to provide the desired power output.