Modular Power Module Housing With Adjustable Sidewalls
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Solution Overview
Problem
Conventional power modules have fixed outer housing structures that limit accommodable substrate size, leading to wasted materials and decreased power density, increasing manufacturing costs due to the need for re-molding when adapting to new topologies or power levels.
Innovation Solution
A modular housing structure with flexible, extendable sidewalls and covers that can be assembled to accommodate substrates of varying sizes, eliminating the need for re-molding and reducing space waste, thereby enhancing power density and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a fixed outer housing structure is used, then the manufacturing process is simple, but the accommodation space is limited and power density decreases
Solution Approach 1:
The outer housing structure is divided into a base and multiple sidewalls that can be independently assembled. The sidewalls include first sidewalls and second sidewalls with different lengths, allowing selective assembly to create varying accommodation spaces while maintaining manufacturing simplicity through standardized modular components.
2Loss of substance
If a fixed outer housing structure is used, then the material cost is controlled, but space waste increases and power density decreases
Solution Approach 1:
The housing structure transitions from a fixed configuration to a dynamic, adjustable configuration. By selectively assembling first and second sidewalls of different lengths, the accommodation space can be optimized to match the substrate size, eliminating space waste and improving power density while maintaining material cost efficiency.
3Adaptability or versatility
If the outer housing structure is re-molded for new topology or power level, then the adaptability increases, but the manufacturing cost increases
Solution Approach 1:
The base and sidewalls are designed as universal modular components that can be assembled in different configurations to accommodate various substrate sizes and power levels. This multi-functional design eliminates the need for re-molding tools while maintaining adaptability to new topologies, significantly reducing manufacturing costs.
4Volume of stationary object
If the outer housing structure is re-molded for larger substrate, then the accommodation space increases, but the manufacturing cost and tool managing cost increase
Solution Approach 1:
Instead of creating entirely new housing structures through re-molding, the accommodation space is expanded by selectively adding or combining sidewalls of different lengths onto the universal base. This segmentation approach allows space expansion without requiring new molding tools, eliminating tool managing costs while providing scalable accommodation space.
Data Source
Figure 1A
Figure 1B
Figure 1C~1D
AI summary
The present invention provides a power module (1) including a substrate (2) and a modular housing structure (3, 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h, 3i, 3j, 3k, 3m, 3n). The substrate (2) includes an electronic element (21) disposed thereon. The modular housing structure (3, 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h, 3i, 3j, 3k, 3m, 3n) is disposed on the substrate (2) and located around the electronic element (21). The modular housing structure (3, 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h, 3i, 3j, 3k, 3m, 3n) includes a plurality of sidewalls (31, 32, 35, 36) configured to connect with each other detachably. Each sidewall (31, 32, 35, 36) includes two connecting elements (311, 312, 321, 322, 351, 352, 361, 362) disposed on two opposite ends thereof respectively. The two connecting elements (311, 312, 321, 322, 351, 352, 361, 362) of any one of the sidewalls (31, 32, 35, 36) are connected to two corresponding connecting elements (311, 312, 321, 322, 351, 352, 361, 362) of two adjacent sidewalls (31, 32, 35, 36) respectively. Consequently, the numbers and connections of the sidewalls (31, 32, 35, 36) are adjustable and varied according to the size of the substrate (2) so as to avoid the waste of space and enhance the power density.