Modular Power Module With Integrated Coolant Passageway

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Solution Overview

Problem

In automotive vehicle power electronics systems, particularly in traction inverters, achieving high power density and low-profile assembly is challenging due to the conventional stacked power-module-on-cold-plate arrangement, which hinders efficient heat transfer and component integration.

Innovation Solution

The integration of power modules and heat sinks into a single modular component with over-molded coolant passageways and interlocking features, allowing for improved heat transfer and reduced component profile, is proposed. This design includes a power card with a substrate, metal circuitry, signal pins, and power terminals, where the casing defines a coolant passageway that provides a continuous thermal path and can be sealed with gaskets or adhesives for enhanced sealing and assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional stacked power-module-on-cold-plate arrangement is used, then assembly is simpler, but heat transfer efficiency deteriorates and component profile increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidcomponent integration

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the power module and heat sink into a single integrated component. The casing is over-molded directly onto the power card, with coolant passageways embedded within the casing itself, eliminating the need for separate stacked components. This integration provides continuous thermal paths from the power card through the casing to the coolant passageways, significantly improving heat transfer efficiency while reducing overall component profile.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a stacked three-dimensional arrangement to a planar integrated structure. The coolant passageways are positioned adjacent to the power card within the same planar assembly, with thermal paths extending continuously from the power card through the casing. This dimensional reorganization improves thermal coupling while reducing the vertical profile of the assembly.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If power modules are integrated into single component, then component profile is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvecomponent profileVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The casing is over-molded directly onto the power card in a preliminary manufacturing step, forming the integrated structure before final assembly. The coolant passageways are created within the casing during the over-molding process itself, eliminating subsequent machining or assembly steps. Gaskets are pre-positioned in troughs formed around the coolant passageway openings, simplifying the sealing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The power card is nested within the casing structure, with the coolant passageways embedded within the casing material. The gaskets are nested within troughs formed around the coolant passageway openings. This nested arrangement creates a compact integrated component with reduced overall volume while maintaining manufacturability through sequential formation of nested structures.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If over-molded casing with integrated passageways is used, then thermal path continuity is improved, but sealing complexity increases

Engineering Contradiction:

Improvethermal path continuityVSAvoidsealing structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The casing is designed with localized troughs formed around specific openings of the coolant passageways. These troughs are positioned precisely where sealing is needed, creating local sealing zones without compromising the overall integrated structure. The troughs are configured to receive gaskets that seal the interface between adjacent power modules, providing reliable sealing at critical locations while maintaining thermal path continuity elsewhere.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat transfer efficiency and reduces the overall component profile, offering a more reliable and compact power module assembly suitable for high-power density applications in electrified vehicles by integrating thermal management directly into the power module.

Implementation Method 1

a casing over molded on the power card to define a coolant passageway extending between opposite ends of the power module, and to define a continuous uninterrupted thermal path from the power card to the coolant passageway

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10798854B2Modular power module with integrated coolant passageway and assemblies thereof

Publication Date: 2020.10.06 FORD GLOBAL TECH LLC

AI summary

Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.