Modular Power Module Layout for Low-Inductance High-Voltage Packaging
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Solution Overview
Problem
High power applications require compact, high voltage, high current, and low inductance power modules that can accommodate various power devices and circuit topologies, but existing solutions struggle with scalability and modularity while maintaining performance and safety standards.
Innovation Solution
A novel power module design featuring a size- and cost-optimized power substrate with a scalable and modular layout, incorporating a thermal pad, grouped signal and power terminals, and creepage extenders to ensure efficient heat transfer and electrical isolation, allowing for easy scaling and parallel configuration of power devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power devices and terminals are arranged in a conventional layout, then the module can accommodate basic power circuit requirements, but the module size increases and scalability is limited
Solution Approach 1:
The power substrate is divided into distinct functional regions: a first region for input power terminals, a second region for output power terminals, and a third region for signal terminals. This segmentation allows each region to be independently optimized and enables modular scaling by replicating or expanding specific regions without redesigning the entire substrate layout.
Solution Approach 2:
The patent utilizes multi-dimensional arrangement of terminals on the substrate, organizing them in spatial dimensions that optimize both compactness and scalability. The input terminals, output terminals, and signal terminals are positioned in different regions and orientations, allowing the module to scale by adding terminals in additional spatial dimensions rather than simply expanding in one direction.
2Reliability
If terminals are grouped by function on the substrate, then electrical isolation and safety are improved, but the substrate area increases
Solution Approach 1:
The patent merges multiple terminal functions into integrated terminal structures that provide both power and signal capabilities. The input power terminals and output power terminals are designed as multi-functional components that can serve both power transmission and signal reference functions, reducing the need for separate dedicated terminals and thereby minimizing substrate area while maintaining electrical isolation.
3Power
If the module design is optimized for high power applications, then power handling capability increases, but the complexity of accommodating various circuit topologies increases
Solution Approach 1:
The power substrate is designed with universal terminal configurations that can accommodate multiple circuit topologies including half-bridge, full-bridge, and three-phase configurations. The standardized region-based layout allows the same substrate design to support different power circuit architectures by simply changing the connection patterns, thereby maintaining high power handling capability while reducing design complexity across different applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves compact, efficient, and scalable power modules with reduced inductance and voltage overshoot, supporting high current and voltage operations while minimizing creepage distances, thus enhancing performance and reducing costs.
Implementation Method 1
The substrate has a backside with a thermal pad... The housing encompasses the substrate, the power devices... efficient heat transfer
Data Source
AI summary
A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.