Modular Power Overlay Layout for Dense, Thermally Managed Converters
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Solution Overview
Problem
Conventional power electronic modules face challenges in achieving high power density and efficient thermal management due to limitations in packaging and interconnect structures, which affect the performance and reliability of power semiconductor devices.
Innovation Solution
The development of a modular power overlay (POL) module system that utilizes multiple layers of conductive and insulative materials to support power semiconductor devices, providing electrical interconnections and managing heat generation, with a planar copper interconnection structure and vias through a dielectric layer for direct metallic connections, allowing for flexible and modular circuit configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional packaging and interconnect structures are used in power electronic modules, then manufacturing and assembly are simpler, but power density and thermal management performance are insufficient
Solution Approach 1:
The patent transitions from conventional two-dimensional circuit board layouts to a three-dimensional power overlay module architecture. Multiple power semiconductor devices are stacked vertically with conductive layers and vias providing electrical interconnections between layers, enabling higher power density by utilizing the third dimension for component arrangement and heat dissipation pathways
Solution Approach 2:
The patent employs composite material structures including conductive layers (copper or aluminum), insulative layers (ceramic or polymer), and metallized vias embedded within a substrate. This multi-material composite approach enables simultaneous achievement of electrical conductivity, thermal management, and mechanical structural integrity in the power overlay module
2Reliability
If multiple layers of conductive and insulative materials are used to support power semiconductor devices, then electrical interconnections and thermal management are improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the power electronic system into modular power overlay components, each containing specific power semiconductor devices and associated conductive/insulative layers. This segmentation allows for standardized manufacturing of individual modules that can be assembled into complete power electronic systems, reducing overall manufacturing complexity while maintaining high electrical interconnection reliability
Solution Approach 2:
The conductive layers, insulative layers, and vias are pre-formed and integrated into the power overlay substrate before mounting the power semiconductor devices. This preliminary preparation of the interconnection structure simplifies the subsequent device assembly process and ensures reliable electrical connections from the outset
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The POL module system enhances power density and thermal management, enabling efficient and reliable operation of power semiconductor devices, supporting flexible circuit configurations and improved performance in applications such as AC drives and flexible AC transmission systems.
Implementation Method 1
a first dielectric layer having a first side and an opposing second side; a first conductive layer disposed on the first dielectric layer first side
Implementation Method 2
vias through a dielectric layer for direct metallic connections
Implementation Method 3
planar copper interconnection structure and vias through a dielectric layer for direct metallic connections, allowing for flexible and modular circuit configurations
Data Source
AI summary
A modular POL component can be arranged to define a half-bridge converter topology, and can be coupled with other modular POL power components to define a full-bridge or 3-phase AC converter topology based on a desired power output. The assembled POL components can be mounted on a common electrically insulative substrate to define a POL power conversion device to provide the desired power output.