Modular Power Overlay Tiles for Fast Low-Inductance Switching
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Solution Overview
Problem
Conventional power systems, such as those in aircraft, face inefficiencies due to high inductance and impedance in power switching components, leading to slower switching times and higher losses, which can be exacerbated by mechanical stress and vibration in dynamic environments.
Innovation Solution
A modular power overlay architecture featuring interchangeable power overlay tiles with solid state switching components, such as SiC or GaN MOSFETs, arranged in a planar configuration to minimize inductance and impedance, and a low stress bus bar connector to reduce mechanical stress and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional power switching components are used, then the system structure is simpler, but the inductance and impedance are high leading to slower switching times
Solution Approach 1:
The power system is divided into modular power overlay tiles that can be selectively installed on the substrate. Each tile contains specific power switching components (SiC or GaN MOSFETs) arranged in a planar configuration, allowing the system to be segmented into functional units that can be independently optimized and replaced.
Solution Approach 2:
Conventional mechanical power switching components are replaced with solid state switching components (SiC or GaN MOSFETs) arranged in a planar power overlay architecture. This substitution eliminates mechanical moving parts, reduces inductance and impedance, and enables faster switching times without mechanical wear or vibration.
2Loss of energy
If conventional power systems are used, then the design is more traditional, but power losses are higher
Solution Approach 1:
The power switching components are arranged in a planar configuration on overlay tiles that are mounted on a substrate, transitioning from conventional three-dimensional stacked arrangements to a two-dimensional planar layout. This dimensional change reduces current path length, minimizes inductance, and lowers power losses while maintaining electrical functionality.
Solution Approach 2:
The invention changes key electrical parameters by using solid state switching components with inherently lower on-resistance and arranging them in configurations that minimize parasitic inductance and impedance. These parameter changes directly reduce conduction and switching losses compared to conventional components.
3Ease of repair
If power overlay tiles are made interchangeable for modularity, then repairability improves, but connection complexity increases
Solution Approach 1:
Multiple power overlay tiles are designed with standardized interfaces and common planar footprints, allowing them to be universally interchanged on the substrate. Each tile can serve different functional purposes (different power switching configurations), but they all connect through the same standardized interface, enabling modular repair and reconfiguration without requiring different connection mechanisms for each tile type.
Data Source
AI summary
A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.