Modular Power Voltage Regulator Module for Memory Scalability
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Solution Overview
Problem
Traditional power delivery methods for memory modules, either on the main system board or within the memory module itself, face issues such as increased connector pins, scalability limitations, cost redundancy, and power integrity risks due to the placement of voltage regulators and power management ICs.
Innovation Solution
The implementation of modular power voltage regulator modules that use Compression Mount Technology (CMT) connectors, Ball Grid Arrays (BGAs), or other connector technologies to provide power to multiple memory modules, allowing for side-by-side or stacked configurations and enabling a single power VR module to supply power to multiple LP/DDR memory modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If voltage regulators and power management ICs are placed on the main system board, then power delivery can be centralized, but extra connector pins are required and scalability is limited
Solution Approach 1:
The patent segments the power delivery system by placing voltage regulators and power management ICs on a separate power management module rather than integrating them into the main system board or memory modules. This modular segmentation allows the power management module to be independently designed and configured for different memory module generations without requiring changes to the main system board, thereby resolving the contradiction between centralized power delivery and scalability.
Solution Approach 2:
The patent introduces a dedicated power management module as an intermediary component between the main system board and memory modules. This intermediary module handles all power delivery functions, eliminating the need for extra connector pins on the main board while providing a standardized interface that can accommodate future memory module generations, thus resolving the scalability limitation.
2Reliability
If voltage regulators are locked by platform with design for maximum module power load, then power delivery capability is ensured, but design and cost are locked and cannot scale per configuration
Solution Approach 1:
The patent implements a dynamic power management module that can be independently configured and upgraded without being locked to a specific platform or memory module generation. The modular design allows the power management capabilities to adapt dynamically to different configurations and power load requirements, eliminating the need to design for maximum power load in all cases and reducing costs for lower-power applications.
3Device complexity
If VR is placed on platform, then power delivery is centralized, but VR is further away from memory devices leading to power integrity risks
Solution Approach 1:
The patent introduces a power management module as an intermediary that sits physically closer to the memory devices than the main system board VRs while still being a separate, manageable component. This intermediary position allows the system to maintain centralized power management benefits while reducing the distance between voltage regulators and memory devices, thereby improving power integrity through shorter trace lengths and reduced impedance variations.
4Adaptability or versatility
If each memory module has its own PMIC, then power management is modular, but cost increases due to redundancy of power delivery components
Solution Approach 1:
The patent merges the power management functions from multiple individual memory modules into a single shared power management module. This consolidation eliminates the redundancy of having separate PMICs in each memory module while still allowing each memory module to be independently configured and upgraded. The shared power management module serves multiple memory modules, reducing overall component count and cost while maintaining modular flexibility.
Data Source
AI summary
Apparatus, assemblies, and platforms employing modular power voltage regulator (VR) modules to provide power to memory modules. A power VR module includes VR circuitry integrated on or coupled to a substrate with wiring coupling the VR circuitry to connector elements in first and second connector means. An assembly further includes a pair of memory modules (e.g., DDR) that are coupled to a power VR module via mating connector means. The connector means may be coupled using a Compression Mount Technology (CMT) connector disposed between arrays of CMT contact pads on the power VR module and the memory modules, or may comprise BGAs, PGAs, and LGAs. The power VR module receives one or more input voltages via one or both memory module and provide various output voltages to each of the memory modules to power memory devices and other circuitry on those modules.