Modular Printhead Assembly Base and Substrate Design

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Solution Overview

Problem

The increasing length of printhead dies and decreasing spacing between ink feed slots in inkjet printing systems make them more fragile, necessitating a solution to enhance mechanical support and fluidic routing while maintaining high resolution.

Innovation Solution

A modular printhead assembly with a base and substrates that provide mechanical support and fluidic routing for the printhead die, featuring interchangeable substrates with varying material properties and fluidic geometries to minimize stress and optimize performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the length of the printhead die is increased and the spacing between ink feed slots is decreased, then the number of nozzles and resolution are improved, but the fragility of the printhead die increases

Engineering Contradiction:
ImproveresolutionVSAvoidfragility
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The printhead assembly is divided into separate modular components: a base component and interchangeable substrate components. The substrate containing the printhead die is separated from the base, allowing the die to be replaced without replacing the entire assembly. This segmentation enables better protection of the fragile die while maintaining high resolution through precise fluidic routing in the substrate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention allows changing material parameters of the substrate (such as using glass instead of polymer) to optimize both fragility resistance and resolution. Different substrate materials can be selected based on specific application requirements, enabling parameter optimization for the thin-film printhead die while maintaining manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the length of the printhead die is increased, then the print swath is improved, but the mechanical strength decreases

Engineering Contradiction:
Improveprint swathVSAvoidmechanical strength
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

By separating the printhead die from the base into interchangeable substrate components, the design allows the long printhead die to be supported by a robust base structure. The substrate can be optimized for mechanical strength while the base provides additional structural support, enabling increased print swath without compromising mechanical strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The printhead assembly uses composite construction combining different materials for the base and substrate components. This allows optimization of each component for its specific function - the base for mechanical strength and the substrate for fluidic precision - thereby supporting longer printhead dies with increased print swath while maintaining overall mechanical strength.

Inventive Principle:
Principle #40Composite materials

3Manufacturing precision

If the spacing between ink feed slots is decreased, then the resolution is improved, but the potential for stress concentration increases

Engineering Contradiction:
Improveslot pitchVSAvoidstress concentration
Core Design Contradiction:
Manufacturing precisionVSStress or pressure

Solution Approach 1:

The substrate is designed with localized quality variations including reinforcement features and optimized fluidic passage geometries at critical stress points. This allows maintaining tight slot pitch for high resolution while locally enhancing stress resistance in areas prone to concentration, such as around fluidic passages and mounting interfaces.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Material parameters of the substrate can be optimized to reduce stress concentration while maintaining fine slot pitch. Different substrate materials with varying mechanical properties can be selected, and parameters such as thickness and material composition can be adjusted to minimize stress concentration effects in high-resolution configurations with decreased slot spacing.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS7758163B2Base and substrate for printhead assembly
Publication Date: 2010.07.20 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • US7758163B2 patent drawing
  • US7758163B2 patent drawing
  • US7758163B2 patent drawing

AI summary

A printhead assembly includes a base having a pocket formed therein, a substrate having at least one fluid passage formed therethrough received within the pocket of the base, and a printhead die supported by the substrate and communicated with the at least one fluid passage of the substrate.