Modular Probe Card Space Transformer for High-Temperature Planarity
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Solution Overview
Problem
Existing probe cards face challenges in ensuring planarity and functional integrity, particularly at high temperatures, due to thermal expansion and planarity issues with traditional materials and structures, especially in large-sized cards used for testing devices with closely spaced contact pads.
Innovation Solution
A probe card design featuring a space transformer composed of independent, coplanar modules with connecting structures that ensure precise alignment and integration, using modules with minimal thickness connections and optional adhesive films or welds for stable assembly, allowing for easy testing and replacement of faulty modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional space transformer materials and structures are used, then manufacturing is simpler, but planarity and functional integrity deteriorate at high temperatures due to thermal expansion
Solution Approach 1:
The space transformer is divided into multiple independent modules, each with its own contact pads and electrical connections. This segmentation allows each module to be manufactured and tested separately, improving overall reliability while managing thermal expansion effects locally rather than across the entire structure.
Solution Approach 2:
The patent changes the material parameters of the space transformer modules to have low thermal expansion coefficients, ensuring that the modules maintain their dimensional stability and planarity under high temperature conditions, thus improving reliability without significantly complicating manufacturing.
2Adaptability or versatility
If large-sized probe cards are used for testing devices with closely spaced contact pads, then testing capability is improved, but planarity issues and thermal expansion problems worsen
Solution Approach 1:
By dividing the large probe card into multiple smaller modules, each module can be manufactured with high precision and maintained planarity is easier. The modular structure allows the large probe card to achieve testing capability for closely spaced pads while avoiding the planarity issues that would arise in a single large structure.
Solution Approach 2:
The patent uses a three-dimensional modular structure where modules are stacked or arranged in specific configurations, allowing the probe card to achieve the necessary testing capability for closely spaced pads while maintaining planarity through vertical or distributed arrangement rather than relying solely on a large flat surface.
3Ease of manufacture
If modular space transformer structure is used, then assembly is simplified and manufacturing costs are reduced, but structural integrity and alignment precision may worsen
Solution Approach 1:
The modules are connected through integrating structures that combine multiple functions: mechanical support, electrical connection, and alignment reference. This merging ensures that while the probe card is easier to manufacture in modules, the assembled structure maintains high alignment precision and structural integrity.
Solution Approach 2:
The patent introduces integrating structures as intermediary elements between modules that provide precise alignment references and secure mechanical connections. These intermediaries ensure that module assembly is simple while maintaining high alignment precision, resolving the contradiction between ease of manufacture and manufacturing precision.
4Reliability
If contact probes are made movable inside guide holes for bending and sliding contact, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The probe head is divided into modular sections with guides and contact probes that can be independently manufactured and assembled. This segmentation maintains the reliable movable contact mechanism while reducing overall device complexity through standardized modular components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains planarity and functional integrity across temperature variations, enabling reliable electrical contact for large-sized cards, simplifying assembly, and reducing manufacturing costs by allowing module testing before integration.
Implementation Method 1
the contact probes, which are movable inside the guide holes made in the upper and lower guides, undergoing, during said pressing contact, a bending, inside the air gap between the two guides
Implementation Method 2
using modules with minimal thickness connections and optional adhesive films or welds for stable assembly
Data Source
AI summary
A probe card mounted in an of electronic device testing apparatus is described, having a probe head housing a plurality of contact probes, each having a first end portion which abuts onto contact pads of a device under test, a main board and a connected intermediate board which provides a distance spatial transformation between contact pads made on opposite faces thereof. The intermediate board is a space transformer which includes a plurality of modules that are plate-shaped and coplanar, and structurally and functionally independent from each other. Each module has a first face facing towards the probe head and a first plurality of contact pads whereonto respective second end portions of the contact probes abut and an opposite second face facing towards the main board. The second face has a second plurality of contact pads connected to the first plurality of contact pads.