Modular Probe Card Unit Blocks for Pitch Compensation
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Solution Overview
Problem
The existing probe card manufacturing process is complex, time-consuming, and costly, with low productivity and the need for replacing entire blocks when damaged, leading to increased costs.
Innovation Solution
A probe card design featuring a block composed of multiple unit blocks with insulation and conducting portions, allowing for partial replacement and simplification of the manufacturing process, where unit blocks are arranged in a specific pattern to intersect and match, enabling efficient electrical connection and compensation of pitch differences between probe pins and contact points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer ceramic structure is used for the block, then electrical connectivity and insulation are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The block is divided into multiple independent layers: a substrate layer, an insulation layer with via holes, and a conducting layer. This segmentation allows each layer to be manufactured and processed separately, then assembled together, significantly simplifying the manufacturing process while maintaining electrical connectivity and insulation functions.
2Reliability
If a multilayer ceramic structure is used for the block, then electrical connectivity is ensured, but manufacturing time and cost increase
Solution Approach 1:
The block is divided into multiple independent layers: a substrate layer, an insulation layer with via holes, and a conducting layer. This segmentation allows each layer to be manufactured and processed separately, then assembled together, significantly simplifying the manufacturing process while maintaining electrical connectivity and insulation functions.
3Reliability
If the entire block is replaced when damaged, then reliability is maintained, but cost increases
Solution Approach 1:
The block is divided into multiple independent layers: a substrate layer, an insulation layer with via holes, and a conducting layer. This segmentation allows each layer to be manufactured and processed separately, then assembled together, significantly simplifying the manufacturing process while maintaining electrical connectivity and insulation functions.
Solution Approach 2:
The modular layered structure enables selective replacement of only the damaged layer rather than the entire block. The intact layers can be recovered and reused, reducing material waste and replacement costs while maintaining the reliability of the overall structure.
4Volume of moving object
If the pitch between probe pins is reduced, then miniaturization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The via holes provide a vertical dimension for electrical connection, allowing the conducting layer to be positioned precisely relative to the probe pins. This dimensional approach enables reduced pitch between probe pins while maintaining manufacturing precision through the structured alignment of via holes in the insulation layer.
Data Source
AI summary
Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.