Modular Quantum Processor Coupling for Scalable Qubit Integration

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Solution Overview

Problem

Existing quantum processor architectures face challenges in manufacturing efficiency and yield, particularly as the number of qubits increases, due to the exponential rise in the number of chips that need to be fabricated to achieve a functional quantum computer, and the lack of flexibility in incorporating different types of devices with varying architectures or purposes.

Innovation Solution

A modular quantum processor architecture is introduced, comprising multiple distinct quantum processor modules that are individually fabricated and tested, allowing for separate design and integration of chips with different functionalities, connected through resonator buses and signal lines on a substrate or PCB, enabling scalable and efficient manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a monolithic quantum processor architecture is used, then the system can be manufactured as a single chip, but the number of chips that need to be fabricated increases exponentially as the number of qubits increases

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidnumber of chips
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent divides the quantum processor into multiple modular chips, each containing a subset of qubits and quantum circuit devices. This segmentation allows the system to be constructed from smaller, more manageable units that can be fabricated and tested independently, reducing the exponential complexity of manufacturing large-scale quantum processors as a single monolithic chip.

Inventive Principle:
Principle #1Segmentation

2Reliability

If more qubits are integrated into a single chip, then the computational power increases, but the manufacturing yield decreases due to increased complexity

Engineering Contradiction:
Improvemanufacturing yieldVSAvoidchip complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By segmenting the quantum processor into multiple modular chips with fewer qubits each, the patent improves manufacturing yield. Each module can be fabricated and tested independently with lower complexity, increasing the probability of achieving functional chips. The overall system is assembled from these verified modules rather than attempting to manufacture a single complex chip.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the parameter of chip size and complexity by using multiple smaller chips instead of one large chip. This parameter change allows for improved manufacturing yield while maintaining the total qubit count needed for desired computational power.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If a fixed quantum processor architecture is used, then the manufacturing process is simplified, but the flexibility to incorporate different types of devices with varying architectures is reduced

Engineering Contradiction:
Improvedesign flexibilityVSAvoidmanufacturing simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent implements segmentation into modular chips that can be independently designed and fabricated. This allows different types of quantum circuit devices with varying architectures to be incorporated into separate modules, which are then assembled into a functional quantum processor. This modular approach provides design flexibility while maintaining manufacturing simplicity through standardized connection interfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates universal modular chips that can serve multiple functions and be configured in different ways. These modules can be assembled to create quantum processors with different architectures and functionalities, providing adaptability without requiring completely different manufacturing processes for each configuration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250342380A1Modular Quantum Processor Architectures
Publication Date: 2025.11.06 RIGETTI & CO INC
  • US20250342380A1 patent drawing
  • US20250342380A1 patent drawing
  • US20250342380A1 patent drawing

AI summary

In a general aspect, a quantum processor has a modular architecture. In some aspects, a modular quantum processor includes first and second quantum processor chips and a cap structure. The first quantum processor chip is supported on a substrate layer and includes a first plurality of qubit devices. The second quantum processor chip is supported on the substrate layer and includes a second plurality of qubit devices. The cap structure is supported on the first and second quantum processor chips and includes a coupler device that provides coupling between at least one of the first plurality of qubit devices with at least one of the second plurality of qubit devices. In some instances, the coupler device is an active coupler device that is configured to selectively couple at least one of the first plurality of qubit devices with at least one of the second plurality of qubit devices.