Modular Qubit Chip Packaging for High-Density Quantum Coupling
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Solution Overview
Problem
The challenge in constructing quantum computing hardware is the difficulty in fabricating quantum chips with increased qubit counts as monolithic devices, which leads to issues such as wafer size limitations, tool availability, handling, and yield concerns.
Innovation Solution
A modular quantum computing structure is proposed, featuring a plurality of attachment structures with varying thicknesses, where qubit chips are bonded to these structures, allowing their footprints to extend beyond the attachment structures to overlap adjacent ones, facilitating capacitive or inductive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If quantum chips are fabricated as monolithic devices with increased qubit counts, then the number of qubits increases, but fabrication difficulty increases due to wafer size limitations, tool availability, handling, and yield issues
Solution Approach 1:
The quantum computing system is divided into multiple separate quantum chips, each containing a subset of qubits. These chips are fabricated independently on standard-sized wafers using existing fabrication tools, avoiding the need for large-wafer monolithic fabrication. The chips are then integrated through interposers with attachment structures that enable electrical connections between chips, effectively segmenting the manufacturing process while achieving high total qubit counts.
2Device complexity
If quantum chips are made as monolithic devices, then all qubits are on a single chip, but practical concerns such as tool availability, handling, and yield issues arise
Solution Approach 1:
Instead of fabricating all qubits on a single large chip, the system segments qubits across multiple smaller chips. Each chip can be fabricated independently with higher yield on standard wafers. The interposer technology with protruding attachment structures enables reliable electrical interconnection between these segmented chips, maintaining system functionality while improving manufacturing yield.
3Adaptability or versatility
If modular attachment structures with varying thicknesses are used, then qubit chips can be bonded to different attachment structures, but the structure becomes more complex
Solution Approach 1:
The interposers are designed with local quality variations, where specific regions have different thicknesses to create protruding attachment structures. This allows different areas of the interposer to serve different functions: some regions provide bonding surfaces for quantum chips while other regions extend to facilitate capacitive or inductive coupling with adjacent chips. The varying thickness is strategically applied only where needed rather than uniformly across the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This modular approach enables an increased number of qubits to be arranged in a smaller area, overcoming the challenges of monolithic structures by improving yield and reducing tool availability issues, while maintaining efficient coupling between qubit chips.
Implementation Method 1
the first qubit chip extends beyond a footprint of the first interposer so as to overlap the second interposer... facilitating capacitive or inductive coupling
Implementation Method 2
the first qubit chip extends beyond a footprint of the first interposer so as to overlap the second interposer... facilitating capacitive or inductive coupling
Data Source
AI summary
A modular quantum computing structure includes a plurality of attachment structures, at least some of the attachment structures having different thicknesses. At least one of a plurality of qubit chips is bonded to a first attachment structure of the plurality of attachment structures having a first thickness. A second attachment structure of the plurality of attachment structures arranged adjacent the first attachment structure has a second thickness different from the first thickness of the first attachment structure. At least one of the qubit chips bonded to the first attachment structure has a footprint extending beyond a footprint of the first interposer to overlap at least the second interposer.