Modular Quick-Release Liquid Cooling Coupling for Server Racks

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Solution Overview

Problem

Existing data center cooling systems face challenges in efficiently removing heat from IT components due to increased heat generation from improved server performance, leading to decreased reliability and high power consumption for thermal management, particularly with indirect air cooling methods.

Innovation Solution

A modular quick-release liquid heat removal coupling system is introduced, featuring a dual liquid loop design with a primary and secondary loop, where a heat removal liquid manifold and quick-release connectors enable efficient heat transfer from server blades to a rack manifold, using flexible hoses and locking mechanisms for easy operation and maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If direct liquid cooling is used to remove heat from servers, then heat removal efficiency is improved and power consumption is reduced, but device complexity and maintenance difficulty increase

Engineering Contradiction:
Improvepower consumption for thermal managementVSAvoidcomplexity of server and rack design
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The system divides the cooling infrastructure into modular components: server-level quick-connectors, rack-level manifolds, and flexible hoses. This segmentation allows each component to be optimized independently and simplifies maintenance by enabling localized repairs without shutting down entire systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The quick-connect mechanism enables dynamic reconfiguration of cooling connections. Servers can be quickly connected or disconnected from cooling manifolds without permanent installations, allowing flexible adaptation to changing thermal loads and maintenance needs.

Inventive Principle:
Principle #15Dynamics

2Loss of energy

If direct liquid cooling is implemented, then cooling capacity is improved with less power, but ease of use and deployment are reduced

Engineering Contradiction:
Improvepower consumption for coolingVSAvoidease of use and deployment
Core Design Contradiction:
Loss of energyVSEase of operation

Solution Approach 1:

The quick-connectors are pre-configured with alignment features and guide structures that automatically orient components during installation. This preliminary design consideration eliminates the need for complex alignment procedures during deployment, making the system as easy to install as traditional air cooling.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The flexible hose acts as an intermediary element between the rigid server connectors and rack manifolds. This mediator absorbs misalignment and positioning variations, allowing quick connection without precise positioning skills, thereby maintaining ease of operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If servers are housed in data centers with increased heat density, then server performance is improved, but reliability decreases due to temperature increase

Engineering Contradiction:
Improveserver performanceVSAvoidreliability of servers
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system uses liquid coolant circulation through quick-connectors and manifolds to directly remove heat from server components. This hydraulic cooling approach efficiently manages the increased heat density from high-performance servers, maintaining operating temperatures within reliable ranges despite higher productivity demands.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat removal efficiency with reduced power consumption, simplifies maintenance and deployment, and prevents wear and tear, maintaining server reliability while allowing for flexible connector orientations and easy disconnection for transportation.

Implementation Method 1

a first liquid intake connector and a first liquid outlet connector capable of extending outwardly external to the server tray to connect to, and disconnect from, a second liquid intake connector and a second liquid outlet connector fixedly disposed on the heat removal liquid manifold assembly

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

heat removal liquid manifold assembly to provide heat removal liquid from an external heat removal system to remove the heat from the server blades

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10609840B2Modular quick-release liquid heat removal coupling system for electronic racks
Publication Date: 2020.03.31 BAIDU USA LLC
  • US10609840B2 patent drawing
  • US10609840B2 patent drawing
  • US10609840B2 patent drawing

AI summary

An electronic rack includes a heat removal liquid manifold, a number of server slots, and a number of server blades inserted therein. The liquid manifold distributes heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain information technology (IT) components and a quick-release coupling assembly having a first liquid intake connector and a first liquid outlet connector coupled to a flexible hose to distribute the heat removal liquid to the IT components. The first liquid intake connector and the first liquid outlet connector are capable of extending outwardly external to the server tray to connect to, and disconnect from, a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold, respectively. The quick-release coupling assembly can self-retract and be secure to a block holder when disconnected.