Modular RF Power Amplifier Assembly for Low-Loss Combining
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Solution Overview
Problem
Existing radio frequency power amplifier modules for high-power applications face limitations in the number of combinable input ports and high combining loss when using semiconductor amplifiers, requiring a large number of amplifiers and complex installation methods.
Innovation Solution
A modular radio frequency power amplifier design featuring a module main body with amplifier semiconductors and couplers that protrude for easy assembly and maintenance, allowing for efficient installation and integration with a combiner, reducing combining loss and simplifying maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing combiners (Wilkinson, Gysel, waveguide) are used to combine multiple semiconductor amplifiers, then the number of combinable input ports is limited, but the combining loss increases rapidly when combining in multi-stage
Solution Approach 1:
The patent divides the amplifier system into modular units, each containing a semiconductor amplifier and an integrated combiner. This segmentation allows multiple modules to be combined in series to achieve high power output while keeping individual combining stages efficient, thus managing combining loss across multiple stages.
Solution Approach 2:
The combiner is integrated within the amplifier module structure, with the combiner cavity nested inside the amplifier housing. This nesting allows the combiner to be part of the amplifier assembly, enabling easy combination of multiple modules while maintaining low combining loss through optimized internal geometry.
2Power
If a large number of semiconductor amplifiers (10-2000) are required for waveguide cavity combiner to output several 100 kW, then high power output is achieved, but installation complexity and cost increase
Solution Approach 1:
The patent merges the amplifier and combiner into a single integrated module. Each module can output several 100 kW with fewer amplifiers by combining them in series, reducing the total number of amplifiers needed from 10-2000 to a manageable number while simplifying installation and maintenance.
Solution Approach 2:
The standardized module design with universal interfaces (flange, assembly slot) allows the same module to be used in various power output configurations. By adjusting the number of modules combined in series, the system can achieve different power levels without redesigning the amplifier or combiner, thus reducing installation complexity.
3Ease of operation
If modular design with protruding coupler and assembly slot is implemented, then ease of assembly and maintenance is improved, but device structure becomes more complex
Solution Approach 1:
The module is segmented into distinct functional components (amplifier section, combiner cavity, coupler, flange) with standardized interfaces. The assembly slot and protruding coupler create a clear mechanical interface that simplifies assembly and disassembly, making the increased structural complexity worthwhile for ease of maintenance.
Solution Approach 2:
The flange acts as an intermediary mechanical interface between modules and the combiner system. This standardized intermediary component simplifies the connection process, providing alignment and mechanical coupling without requiring complex fastening mechanisms, thus improving ease of assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design facilitates easy installation, maintenance, and calibration, reducing combining loss and improving efficiency by allowing individual module verification and replacement, addressing phase and amplitude imbalances, and enhancing overall performance.
Implementation Method 1
a coupler configured to electrically connect to at least one of the one or more amplifier semiconductors, and the coupler protrude and extend outside of the module main body to transmit electromagnetic waves at a radio frequency
Data Source
AI summary
Disclosed is a radio frequency power amplifier module. The radio frequency power amplifier module according to an embodiment of the disclosed technology includes a module main body one or more amplifier semiconductors installed inside the module main body, and a coupler electrically connected to the amplifier semiconductor and protruding and extending to the outside of the module main body to transmit electromagnetic waves.