Modular RF Aperture With Tapered Elements for Compact Broadband Arrays

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Solution Overview

Problem

Current RF apertures face challenges in achieving compact, lightweight, and efficient broadband RF signal transmission and reception due to limitations in design and materials used, which affect their performance and flexibility.

Innovation Solution

The RF aperture design incorporates a digital personality circuit board and air interface planes with matrices of tapered elements, along with conditioning, splitting/combining circuit boards, and a power supply, allowing modular interconnection and a cooling assembly to enhance signal processing and reduce size and weight.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If traditional RF aperture designs are used, then broadband RF signal transmission and reception can be achieved, but the system becomes bulky and heavy

Engineering Contradiction:
ImproveweightVSAvoidperformance
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The RF aperture system is divided into multiple independent circuit boards (AIP circuit board, conditioning circuit board, splitting/combining circuit board, power supply circuit board) that can be modularly interconnected. This segmentation allows the system to achieve the required broadband RF signal transmission and reception performance through distributed functional blocks while reducing overall weight compared to a monolithic design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs thin circuit board substrates to replace traditional bulky RF aperture structures. The tapered elements are mounted on thin circuit boards, enabling the system to maintain broadband RF performance while significantly reducing weight and volume.

Inventive Principle:
Principle #30Flexible shells and thin films

2Volume of moving object

If traditional RF aperture designs are used, then broadband RF signal transmission and reception can be achieved, but the system size increases

Engineering Contradiction:
ImprovesizeVSAvoidperformance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The system is segmented into multiple functional circuit boards that are interconnected through thin substrates and modular connections. This allows the broadband RF performance to be distributed across multiple compact boards rather than requiring a single large structure, thereby reducing overall system volume.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from traditional planar RF aperture designs to a three-dimensional modular architecture where circuit boards are stacked or arranged in multiple layers. This dimensional reorganization allows for compact integration of multiple RF functions while maintaining performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If modular circuit board design is implemented, then system flexibility and maintainability improve, but device complexity increases

Engineering Contradiction:
ImproveflexibilityVSAvoidcomplexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The RF aperture is divided into standardized modular circuit boards with defined interfaces (AIP board, conditioning board, splitting/combining board, power supply board). This segmentation enables flexible reconfiguration and replacement of individual modules while maintaining overall system functionality, and the modular nature actually reduces complexity by isolating functions into manageable units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular circuit board design employs universal interconnection standards and interfaces that allow the same basic board types to serve multiple functions in different configurations. This universality reduces the number of unique components needed, thereby reducing overall device complexity while maintaining high flexibility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of repair

If modular circuit board design is implemented, then ease of repair and component replacement improve, but device complexity increases

Engineering Contradiction:
ImprovemaintainabilityVSAvoidcomplexity
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The system is segmented into independent circuit boards that can be individually accessed, removed, and replaced without affecting other modules. This segmentation dramatically improves ease of repair by allowing technicians to isolate and service only the faulty module, and the standardized interfaces reduce the complexity of replacement procedures.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient, compact, and modular RF signal transmission and reception, improving performance and flexibility by allowing selective removal and replacement of components without affecting the entire system, while maintaining efficient power supply and cooling.

Implementation Method 1

a matrix of tapered elements arranged on the first side of the circuit board and secured to the circuit board, the matrix of tapered elements cooperating to at least one of receive or transmit an over-the-air RF signal

Methodology Applied
Scientific EffectElectromagnetic radiation reception: Electromagnetic Induction

Data Source

PatentUS11936415B2Modular radio frequency aperture
Publication Date: 2024.03.19 BATTELLE MEMORIAL INST
  • US11936415B2 patent drawing
  • US11936415B2 patent drawing
  • US11936415B2 patent drawing

AI summary

An air interface plane (AIP) of a radio frequency (RF) aperture includes: a circuit board having a first side and a second side opposite the first side; and a matrix of tapered elements arranged on the first side of the circuit board and secured to the circuit board, the matrix of tapered elements cooperating to at least one of receive or transmit an over-the-air RF signal. Suitably, each tapered element of the matrix has: a central hub extending along a longitudinal axis from a hub base which is proximate to the first side of the circuit board to an apex of the tapered element which is distal from the first side of the first circuit board; and a plurality of arms extending from the central hub at the apex of the tapered element, each of the plurality of arms including a first portion that projects the arm radially away from the longitudinal axis and a second portion that projects the arm longitudinally toward the first side of the circuit board.