Modular RF Array Architecture for Scalable Antenna Expansion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional large-scale array antennas face issues with reduced flexibility, high complexity, increased fabrication and maintenance costs, and limited expandability due to all-in-one design, which makes them costly and difficult to customize for various applications.
Innovation Solution
A modular arrayed RF system is introduced, decomposing the system architecture into detachable modules with dielectric connections and air cavities for improved airflow and heat dissipation, featuring a mother circuit carrier and sub-modules with RF packaged radiation structures for flexible configuration and modularization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional all-in-one design integrates passive components, beamforming chips, and antennas into a single unit system, then system integration is achieved, but system complexity increases and flexibility is reduced
Solution Approach 1:
The patent divides the conventional all-in-one array antenna system into separate functional modules: passive components (capacitors, resistors), active components (beamforming chips including power amplifiers, phase shifters, low-noise amplifiers), and antenna elements. These modular units can be independently configured and connected through transmission lines, reducing overall system complexity while maintaining flexibility in system design and adaptation to different application requirements.
2Power
If large-scale array antennas are fabricated with increased physical size for higher gain, then antenna gain is improved, but fabrication cost and complexity increase
Solution Approach 1:
The array antenna is designed as a scalable modular system where identical or standardized antenna elements and beamforming modules are replicated and connected in arrays of different sizes. This segmentation allows the system to achieve higher gain through increased array size without requiring custom fabrication for each configuration, thereby reducing per-unit fabrication costs and complexity while maintaining the ability to scale to large physical dimensions.
3Reliability
If conventional array antenna systems are designed as integrated units, then system integration is achieved, but maintenance cost increases due to high sensitivity to RF chip failures
Solution Approach 1:
The system is divided into independent functional modules with standardized interfaces. If an RF chip or other component fails, only the affected modular unit needs to be identified and replaced, rather than replacing the entire array antenna system. This modular architecture improves reliability through isolation of failures and significantly reduces maintenance costs by enabling targeted repairs and simplifying component replacement procedures.
4Ease of manufacture
If modular detachable modules are used in arrayed RF system, then flexibility and ease of manufacture are improved, but system integration complexity increases
Solution Approach 1:
The patent employs standardized modular units with universal interfaces and consistent electrical characteristics that can be used across different array configurations and applications. This universality allows the same basic module to be replicated and connected in various arrangements (different numbers of elements, different geometries) without requiring custom design for each configuration, thereby reducing system integration complexity while maintaining ease of manufacture and flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design simplifies system complexity, reduces fabrication and maintenance costs, enhances stability and expandability, and allows for quick malfunction detection and replacement, thereby improving cost-effectiveness and adaptability.
Implementation Method 1
The modular arrayed RF system has a dielectric connection to form air cavities, increases airflow and heat dissipation
Implementation Method 2
The mother circuit carrier is configured to receive an input intermediate-frequency signal and up-convert the input intermediate-frequency signal to generate the first high-frequency signals
Implementation Method 3
The mother circuit carrier is configured to down-convert the second high-frequency signals to generate an output intermediate-frequency signal
Implementation Method 4
The RF radiation modular groups of the RF packaged radiation structures are respectively configured to receive the first high-frequency signals and emit the first radio-frequency (RF) signals in response to the first high-frequency signals
Data Source
AI summary
An arrayed RF system includes an expandable mother circuit carrier and sub-modules implemented with RF packaged radiation structures. The sub-modules are embedded onto the mother circuit carrier through plug-in interfaces to form a replaceable and expandable co-structural structure. The mother circuit carrier receives and up-converts an input intermediate-frequency signal, thereby generating first high-frequency signals. The sub-modules are horizontally embedded on the mother circuit carrier, arranged into a one-dimensional or two-dimensional array, and electrically connected to the mother circuit carrier. The RF packaged radiation structures respectively receive first high-frequency signals, thereby emitting first RF signals. The RF packaged radiation structures receive second RF signals, thereby generating second high-frequency signals. The mother circuit carrier down-converts the second high-frequency signals, thereby generating an output intermediate-frequency signal.