Modular Ring Frame for Node Housing Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current node housings in broadband networks face issues with weight, heat dissipation, repetitive stress cycling, and difficulty in changing internal components for service upgrades, leading to fatigue and increased maintenance costs.
Innovation Solution
A modular communications equipment support system featuring a ring frame with detachable covers and a structural connector block, allowing for easy access and replacement of components without disturbing electrical and data connections, and enhanced thermal management using finned covers or heat pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If traditional node housings are used with integrated components, then structural integrity is maintained, but component replacement and service upgrades become difficult and time-consuming
Solution Approach 1:
The node housing is divided into separate modular components: a stationary base unit containing cable connection points and a removable cover containing electronic components. This segmentation allows the cover to be easily removed and replaced for component upgrades without affecting the base unit or cable connections, directly resolving the contradiction between ease of repair and structural integrity.
2Reliability
If heavy-duty housing materials are used to ensure durability, then strength and reliability are improved, but weight increases and heat dissipation becomes problematic
Solution Approach 1:
The housing is segmented into a permanent base unit made of durable material for reliability and a removable cover that can be made of lighter material optimized for heat dissipation. This allows the heavy-duty material to be used only where structural strength is critical (the base), while the cover can prioritize thermal management properties, reducing overall weight.
Solution Approach 2:
Different materials with optimized properties are used for different parts of the housing: the base unit uses heavy-duty material for structural reliability, while the cover uses material with superior thermal conductivity for heat dissipation. This local optimization resolves the contradiction between durability and weight/heat management.
3Temperature
If traditional node housings are designed for thermal management, then heat dissipation is improved, but the overall weight and structural complexity increase
Solution Approach 1:
Thermal management features are concentrated in the removable cover rather than being integrated throughout the entire housing structure. The cover can incorporate heat sinks, ventilation channels, or phase change materials specifically for thermal control, while the base unit maintains simple structural design. This segmentation improves heat dissipation without adding complexity to the overall housing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces fatigue cycling, simplifies maintenance and upgrades, enhances thermal control, and enables faster deployment and implementation, while maintaining the integrity of the physical plant and allowing for the reuse of housings, thus reducing costs and improving operational efficiency.
Implementation Method 1
enhanced thermal management using finned covers or heat pipes
Implementation Method 2
heat-dissipating electronic components are mechanically and thermally coupled to the first and second covers
Data Source
AI summary
An assembly includes a ring frame having first and second open sides and an electrical connector block; a mounting structure to which the ring frame is secured; a plurality of power and signal cable connection points defined on the ring frame; and a plurality of power and signal cables coupled to the power and signal cable connection points and the connector block. First and second covers are secured to the ring frame. Each of the first and second covers is open on one side facing the ring frame and defines a mounting cavity. A plurality of heat-dissipating electronic components are mechanically and thermally coupled to the first and second covers and located in the mounting cavities. The heat-dissipating electronic components are releasably electrically coupled to the electrical connector block.