Modular Satellite Docking Structure for Parallel Electronics Integration
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Solution Overview
Problem
The existing satellite production process is labor-intensive due to the manual integration and testing of individual electronics boxes, which significantly increases production time and limits the capacity of integration workplaces, making it inefficient for producing multiple satellites.
Innovation Solution
A modular satellite design featuring a docking structure with electrical and mechanical connection elements, along with device carrier panels that can be pre-manufactured and tested separately, allowing for quick integration and efficient inter-functionality testing at the assembly location, incorporating heat management through integrated heat sources and sinks for thermal regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual integration and testing of individual electronics boxes is used, then each box can be individually tested and integrated, but production time increases significantly and integration workplace capacity is limited
Solution Approach 1:
The satellite is divided into modular device carrier panels that can be pre-assembled and tested separately from the main satellite structure. Each panel contains multiple electronics boxes that are integrated together as a unit before being installed in the satellite, allowing parallel testing and integration activities
Solution Approach 2:
Device carrier panels are pre-manufactured and pre-tested with electronics boxes before satellite assembly. This preliminary integration and testing of sub-assemblies reduces the time required during final satellite assembly and allows quality control to be performed earlier in the production process
2Adaptability or versatility
If individual electronics boxes are manually integrated with electrical and mechanical connections, then each connection can be customized and tested, but integration time increases and workplace occupancy is extended
Solution Approach 1:
The device carrier panels provide standardized mechanical connection elements and electrical connection elements that can accommodate multiple types of electronics boxes through uniform docking stations. This universal interface design allows different electronics boxes to be integrated using the same connection mechanisms, reducing integration complexity and time
Solution Approach 2:
Device carrier panels act as intermediary components between the satellite structure and electronics boxes. These panels provide standardized docking stations that simplify the connection process, eliminating the need for manual customization of each electrical and mechanical connection while maintaining adaptability through the standardized interface design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces integration time, increases production capacity, and enables the efficient production of a larger number of satellites by standardizing the integration process and optimizing thermal management within the satellite's compact rack-like structure.
Implementation Method 1
The respective device carrier panel is configured, at least in certain regions, so as to be temperable by means of integrated heat sources and/or heat sinks
Data Source
AI summary
A modular satellite having a plurality of electronics boxes that accommodate electrical and/or electronic modules. The electronics boxes are or can be electrically connected with one another. The satellite is provided with a basis structural panel, a docking structure disposed on the basis structural panel, and a plurality of device carrier panels that are or can be connected with the docking structure. The docking structure has first electrical connection elements for an electrical connection with the electronics boxes. The device carrier panels have mechanical connection elements for holding the electronics boxes. The respective device carrier panel is configured, at least in certain regions, so that it can be tempered by means of integrated heat sources and/or heat sinks.