Modular Semiconductor Substrate Assortment for High-Performance Integration
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Solution Overview
Problem
The increasing complexity of semiconductor circuit designs and the need for high-speed interface integration in packages with shorter cycle times lead to larger package sizes and complex validation flows, making it challenging to achieve high-end performance with smaller package sizes, especially when replicating low-end solutions.
Innovation Solution
The development of a design method and substrate assortment that enables a high-end connectivity substrate to provide twice the connectivity of a mid/low-end substrate with a package size less than twice that of the mid/low-end arrangement, using a modular parallel design architecture and layout implementation, allowing for integration of multiple device instances and passive components on conventional substrates with reduced size, while maintaining compatibility and simplifying validation flows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple high-speed interfaces and active devices are integrated on packages, then application performance is improved, but package size increases
Solution Approach 1:
The invention segments the package into multiple identical or similar packages, each containing a subset of interfaces and devices. These segmented packages are then coupled together to form a larger system that achieves high-end performance while keeping individual package sizes manageable. This allows the system to scale performance by adding modular units rather than enlarging a single package.
Solution Approach 2:
The invention implements nesting by coupling multiple packages together in a hierarchical structure where individual packages are integrated onto a common substrate or interconnected through standardized interfaces. This nested arrangement allows smaller packages to be combined into a larger system, achieving high-end performance without requiring a single large package.
2Reliability
If multiple interfaces are replicated on packages, then high-end performance is achieved, but validation flow complexity increases
Solution Approach 1:
The invention uses copying by replicating identical or similar package designs multiple times rather than creating unique designs for each interface combination. This modular copying approach allows the same validated design to be reused across multiple packages, significantly reducing validation flow complexity while achieving high-end performance through replication and coupling of proven units.
Solution Approach 2:
The invention implements universality by designing packages with standardized interfaces and configurations that can be used across multiple applications and performance levels. This universal design allows the same package architecture to serve multiple functions and be coupled in different configurations, reducing validation complexity through reuse of validated designs.
3Area of stationary object
If package size is reduced for high-end products, then space efficiency is improved, but integration of multiple interfaces becomes more difficult
Solution Approach 1:
The invention segments the integration challenge by dividing multiple interfaces into separate, identical packages that are then coupled together. This segmentation allows each individual package to be manufactured with standard integration processes, avoiding the need to manufacture a single large package with complex multi-interface integration, thus maintaining ease of manufacture while achieving space efficiency.
Solution Approach 2:
The invention merges multiple identical or similar packages onto a common substrate or interconnect structure to achieve the functionality of a larger package. This merging approach maintains ease of manufacture by using standardized packaging processes for each unit while achieving space efficiency through compact arrangement and coupling of the merged packages.
Data Source
AI summary
A first device includes a rectangular substrate having a first width and a first length and a first pattern of electrical interface nodes at first, second and third sides with a first set of electrical interface nodes at the fourth side. A second device includes a second rectangular substrate having a second width equal to the first width, a second length and a median line extending in the direction of the second width. A second pattern of electrical interface nodes for the second device includes two unmorphed replicas of the first pattern arranged mutually rotated 180° on opposite sides of the median line as well as two second sets of electrical interface nodes formed by two smaller morphed replicas of the first set of electrical interface nodes arranged mutually rotated 180° on opposite sides of said median line.