Modular Semiconductor Test Circuit for Accurate Multi-Voltage Probing
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Solution Overview
Problem
Existing semiconductor testing systems lack flexibility and accuracy due to integrated hardware components, which restricts their compatibility with different packages and drive voltages, increasing manufacturing and maintenance costs.
Innovation Solution
A semiconductor system comprising a testing circuit, a signaling circuit, and a power circuit, where each circuit is physically separated and configured to receive control signals from a processor, allowing for dynamic electrical testing and parameter measurement of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If hardware components are integrated into a single system, then device complexity is reduced, but measurement accuracy and flexibility deteriorate
Solution Approach 1:
The system divides the testing equipment into separate functional modules: a signaling circuit for generating control signals, a testing circuit for parameter measurement, and a power circuit for voltage supply. Each module operates independently and connects through standardized interfaces, allowing individual optimization of measurement accuracy while maintaining overall system functionality.
Solution Approach 2:
The patent introduces standardized communication interfaces and isolation circuits as intermediaries between the separate hardware components. These intermediaries enable precise signal transmission and electrical isolation, ensuring measurement accuracy is maintained despite physical separation of components.
2Device complexity
If hardware components are integrated into a single system, then device complexity is reduced, but adaptability to different packages and drive voltages deteriorates
Solution Approach 1:
The testing circuit and signaling circuit are designed with universal interfaces that can accommodate different semiconductor device packages and drive voltage requirements. The system can be configured to test various device types through software control without requiring hardware redesign, enhancing adaptability while keeping the physical structure relatively simple.
Solution Approach 2:
The system employs dynamically configurable parameters including adjustable voltage levels, frequency ranges, and measurement ranges that can be programmed through the processor. This dynamic adaptability allows the same hardware to work with different device packages and electrical characteristics without physical modification.
3Adaptability or versatility
If hardware components are physically separated, then flexibility and adaptability are improved, but device complexity increases
Solution Approach 1:
The system divides the testing equipment into separate functional modules: a signaling circuit for generating control signals, a testing circuit for parameter measurement, and a power circuit for voltage supply. Each module operates independently and connects through standardized interfaces, allowing individual optimization of measurement accuracy while maintaining overall system functionality.
4Ease of manufacture
If integrated hardware components are used, then manufacturing costs are reduced, but measurement accuracy and flexibility deteriorate
Solution Approach 1:
The system divides the testing equipment into separate functional modules that can be manufactured and tested independently, then assembled through standardized interfaces. This modular approach enables precise manufacturing of each component and simplifies quality control while maintaining measurement accuracy.
Data Source
AI summary
The present disclosure provides a semiconductor system. The semiconductor system includes a testing circuit, a signaling circuit, and a power circuit. The testing circuit is electrically connected to a semiconductor device. The testing circuit is configured to test a parameter of the semiconductor device. The signaling circuit is electrically connected to the testing circuit. The signaling circuit is configured to receive a first control signal from a processor. The processor is configured to generate the first control signal. The power circuit is electrically connected to the testing circuit. The signaling circuit, the testing circuit and the power circuit are physically separated with one another.