Modular Semiconductor Package with Vertical Interconnects
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed semiconductor device and manufacturing method involve a main substrate with conductive and dielectric structures, component modules encapsulated with module encapsulants, and a main encapsulant that provides protection and electrical connectivity, along with vertical interconnects and external interconnects, allowing for a modular and efficient packaging solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but package size becomes too large and cost increases
Solution Approach 1:
The patent implements nesting by placing component modules (containing electronic components) inside the main encapsulant, which itself is mounted on the main substrate. This nested arrangement allows multiple functional elements to occupy overlapping or adjacent spatial volumes, significantly reducing the overall package footprint while maintaining manufacturing feasibility through standardized assembly processes.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional vertical stacking by positioning component modules above the main substrate and using vertical interconnects for electrical connections. This dimensional change enables compact packaging by utilizing the vertical space rather than expanding the lateral package area, thereby reducing overall package size without substantially complicating the manufacturing process.
2Reliability
If conventional semiconductor packages are used, then manufacturing simplicity is maintained, but reliability decreases
Solution Approach 1:
The patent divides the semiconductor package into distinct functional segments: a main substrate, multiple component modules (each containing electronic components and module encapsulants), vertical interconnects, and a main encapsulant. This segmentation isolates different functional elements, allowing for independent testing, replacement, and protection, thereby enhancing overall package reliability. The modular structure enables targeted reliability improvements in specific segments without requiring complete redesign of the entire package.
Solution Approach 2:
The patent employs composite material structures, particularly the main encapsulant that combines protective encapsulation material with integrated conductive interconnects. This composite approach integrates multiple functions (protection and electrical connection) into a single structural element, improving reliability by reducing the number of interfaces and potential failure points while managing the complexity through functional integration.
3Reliability
If conventional semiconductor packages are used, then manufacturing simplicity is maintained, but performance decreases
Solution Approach 1:
The patent utilizes vertical interconnects that extend upward from the main substrate to contact the component modules, enabling three-dimensional electrical connectivity. This vertical interconnection architecture reduces signal transmission distances and improves electrical performance compared to traditional planar routing, while the modular component design manages the associated structural complexity through standardized interfaces and assembly procedures.
Data Source
AI summary
In one example, a semiconductor device comprises a main substrate comprising a first side and a main conductive structure, and a first component module over the first side of the main substrate. The first component module comprises a first electronic component and a first module encapsulant contacting a lateral side of the first electronic component. The semiconductor device further comprises a second component module over the first side of the main substrate. The second component module comprises a second electronic component and a second module encapsulant contacting a lateral side of the second electronic component. The semiconductor device further comprises a main encapsulant over a first side of the main substrate and between the first component module and the second component module. Other examples and related methods are also disclosed herein.