Modular Sensing Assembly Sealing and Repair

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Solution Overview

Problem

Traditional electronic devices face challenges with input mechanisms that are difficult to seal, leading to contamination and lack of component-level testing or easy repair, due to their integrated and complex structures.

Innovation Solution

A modular sensing assembly is introduced, which includes a housing with a recess containing a processing unit, display, and a modular sensing assembly that combines multiple sensors and sub-assemblies, such as touch, fingerprint, audio, and electrocardiograph sensors, with a sealing member to prevent contaminants and facilitate component testing and repair.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional input mechanisms are used, then device functionality is provided, but sealing is difficult and contaminants can enter the device

Engineering Contradiction:

Improvecontaminant entryVSAvoidsealing difficulty

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The input mechanism is divided into a modular sensing assembly that can be separately sealed from the main device body. The assembly enclosure with its own sealing member allows the sensing components to be isolated and sealed independently, preventing contaminant entry while simplifying the sealing process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A sealing member acts as an intermediary element between the modular sensing assembly and the device housing. This sealing member specifically prevents contaminants from entering through the interface between the sensing assembly and the device body, addressing the sealing difficulty.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of repair

If traditional input mechanisms are used, then device functionality is provided, but component-level testing and repair are difficult

Engineering Contradiction:

Improvecomponent testing and repairVSAvoidintegrated structure

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The sensing assembly is segmented as a separate modular unit that can be independently removed from the device housing. This segmentation enables component-level testing and repair of the sensing assembly without disassembling the entire device, significantly improving ease of repair while reducing the complexity of the integrated structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The sensing assembly is extracted as a separate module that can be removed from the main device body. This extraction allows the sensing assembly to be tested and repaired at the component level independently, eliminating the need to disassemble the entire device and simplifying the overall integrated structure.

Inventive Principle:

Principle #2Taking out (Extraction)

3Adaptability or versatility

If multiple sensors are integrated into a single assembly, then device functionality is enhanced, but manufacturing complexity increases

Engineering Contradiction:

Improvemultiple input typesVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple sensing components (touch sensor, audio sensor, translation sensor, electrocardiograph electrode) are merged into a single modular sensing assembly. This merging enhances device functionality by providing multiple input types while the modular design actually reduces manufacturing complexity by allowing the assembly to be produced as one unit and then installed into the device.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The modular sensing assembly provides multi-functionality by incorporating multiple sensors that can detect different types of inputs (touch, audio, translational, ECG). This universal assembly can be installed in various device configurations, enhancing adaptability while the modular nature simplifies manufacturing by allowing standardized production of the sensing assembly itself.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular sensing assembly reduces device component redundancy and manufacturing complexity, provides effective sealing against contaminants, and allows for easy integration with a processing unit, enhancing the device's input and output capabilities while maintaining a compact design.

Implementation Method 1

an electrocardiograph electrode disposed on the cover and configured to detect an electrocardiograph signal

Methodology Applied

Scientific EffectElectrocardiograph signal detection: Electrical Resistance

Implementation Method 2

a capacitive sensor positioned beneath the input surface and configured to detect a touch input on the input surface

Methodology Applied

Scientific EffectCapacitive sensing: Capacitance

Implementation Method 3

an audio sensor positioned beneath the cover and configured to detect an audio input through an opening in the cover

Methodology Applied

Scientific EffectAcoustic detection: Sound

Data Source

PatentUS20230168635A1Modular Sensing Assembly for an Electronic Device

Publication Date: 2023.06.01 APPLE INC

AI summary

A modular sensing assembly may be used to detect user inputs at an electronic device. Example user inputs include touch inputs, fingerprint inputs, translational inputs, audio inputs, biometric inputs, and the like. Inputs received using the modular sensing assembly may be used to control a graphical output of a display of the electronic device. A modular sensing assembly may be configured, for example, as a power button, a key of a keyboard, a control button (e.g., volume control), a home button, a watch crown, and so on.