Modular Sensor on Integrated Circuit Package Body

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Solution Overview

Problem

Conventional sensors requiring special packaging to sense environmental conditions face challenges such as increased cost, complexity, and vulnerability to environmental exposure, which complicates miniaturization and maintenance.

Innovation Solution

A modular sensor design featuring a sensing element, protective element, cover, and traces detachably attached to an integrated circuit chip, utilizing a thin film element and conductive paste connections to avoid special packaging, allowing for easy replacement and maintaining the chip's original size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If special customized packaging is used to enable sensors to sense environmental conditions, then the sensing function is achieved, but the cost and processing complexity increase

Engineering Contradiction:

Improvesensing functionVSAvoidpackaging complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sensor system is divided into separate functional modules: the sensing element, protective element, and connecting ends with pads and bumps. This segmentation allows the sensing function to be achieved without requiring complex integrated packaging, as each component can be independently manufactured and assembled.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The integrated circuit chip package body serves multiple functions: it provides mechanical support for the sensing element, acts as a mounting substrate, and enables electrical connections through its pins. This multi-functionality eliminates the need for additional specialized packaging structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If special customized packaging is used to enable sensors to sense environmental conditions, then the sensing function is achieved, but the manufacturing cost increases

Engineering Contradiction:

Improvesensing functionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The sensor system utilizes the existing integrated circuit chip package body to provide structural support and mounting functions, rather than requiring separate specialized packaging. This self-service approach leverages already-manufactured components, significantly reducing additional manufacturing costs.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The sensing element is directly mounted on the integrated circuit chip package body, merging the structural support function with the sensing function. This consolidation eliminates the need for separate specialized packaging structures and reduces overall manufacturing complexity and cost.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If the integrated circuit chip is open to the outside environment for sensing, then environmental detection is enabled, but the chip elements become vulnerable to environmental failure

Engineering Contradiction:

Improvedetection capabilityVSAvoidenvironmental exposure

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A thin film element is introduced as a protective barrier between the sensing element and the external environment. This thin film allows environmental parameters to be sensed while protecting the chip elements from direct harmful exposure, resolving the contradiction between detection capability and environmental vulnerability.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The protective element acts as an intermediary between the sensing element and the external environment. It enables the sensing function to operate while filtering or protecting against harmful environmental factors, thus maintaining both detection capability and element protection.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Object-affected harmful factors

If conventional standard packaging is used for the integrated circuit chip, then protection from environmental factors is achieved, but the sensing function cannot be performed

Engineering Contradiction:

Improveprotection from environmental factorsVSAvoidsensing function

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The protective function is segmented from the packaging structure and assigned to a dedicated protective element (thin film), while the package body provides mechanical support. This segmentation allows the sensing element to access environmental parameters through the protective element without requiring open packaging.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thin film element serves as a selective barrier that protects the integrated circuit chip from environmental factors while allowing the sensing element to detect environmental parameters. This resolves the contradiction between protection and sensing functionality.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS11674830B2Sensor and integrated circuit module

Publication Date: 2023.06.13 NUVOTON

AI summary

A sensor is provided and is disposed on a package body of an integrated circuit chip. The sensor includes a sensing element, a protective element, a cover, and at least two traces. The sensing element is disposed on the integrated circuit chip. The protective element is disposed on the integrated circuit chip and surrounds the sensing element. The cover is connected to the protective element. The at least two traces are electrically connected to the sensing element and to at least two pins of the integrated circuit chip.