Modular Data Center Cooling With Pressurized Server Airflow
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Solution Overview
Problem
Existing data center cooling methods are inefficient and costly, particularly in high-density environments, leading to over-cooling, space constraints, and difficulty in managing airflow to high-power CPU chips and servers, with traditional systems being unmanageable and expensive.
Innovation Solution
A modular data center system with pressurized air-based cooling assemblies that deliver air directly to individual servers, using compressors to increase air pressure, and regulators to control airflow based on equipment needs, allowing for efficient cooling distribution and optimizing space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional cooling methods are used in high-density data centers, then cooling coverage is provided, but energy consumption increases and cooling efficiency decreases
Solution Approach 1:
The data center is divided into multiple zones with different power densities, and cooling is segmented to match these zones. High-density zones receive liquid cooling while low-density zones receive air cooling, avoiding over-cooling and energy waste in low-density areas.
Solution Approach 2:
Different cooling methods are applied to different locations based on local heat generation. Liquid cooling is applied locally to high-density server racks, while air cooling is used in low-density areas, optimizing energy consumption based on local requirements.
2Temperature
If air cooling is used to increase cooling capacity, then more cooling tonnage is provided, but airflow management complexity increases and efficiency decreases
Solution Approach 1:
The system transitions from air cooling to liquid cooling for high-density zones, using hydraulic principles to efficiently remove heat. Liquid cooling provides superior heat removal capability without the airflow management complexity of traditional air cooling systems.
Solution Approach 2:
The patent replaces the mechanical air cooling system with a liquid cooling system for high-density areas. Liquid cooling substitutes the complex airflow management machinery with a simpler liquid circulation system that is more efficient at heat removal.
3Productivity
If data center density is increased, then space utilization improves, but cooling management difficulty increases
Solution Approach 1:
The cooling system is designed to be dynamic and adaptable, automatically adjusting cooling capacity based on the actual power density and heat generation of servers. This allows high-density deployment while maintaining manageable cooling through automated control.
Solution Approach 2:
The system changes cooling parameters (method, temperature, flow rate) based on the density parameters of the server racks. High-density racks receive liquid cooling with specific flow rates, while low-density racks receive air cooling, optimizing both space utilization and cooling manageability.
4Temperature
If conventional cooling systems are used, then cooling is provided, but infrastructure cost and complexity increase
Solution Approach 1:
The cooling infrastructure is segmented into liquid cooling components for high-density areas and air cooling components for low-density areas. This segmentation allows the system to provide adequate cooling function while reducing overall infrastructure complexity by not deploying complex liquid cooling systems throughout the entire data center.
Solution Approach 2:
The cooling system is designed with universal principles that can be applied at different density levels. The same basic liquid cooling technology is used for both high-density and low-density racks, but with different flow rates and configurations, simplifying infrastructure standardization and reducing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves significant energy savings and increased cooling efficiency by reducing the need for internal server fans, doubling data center capacity, and enabling higher power densities while minimizing space usage and infrastructure complexity.
Implementation Method 1
Air may be driven through the cooling assembly from an air conditioning unit and may be pressurized by a compressor
Implementation Method 2
A modular air-based cooling assembly may be disposed under a raised floor of a data center and the base modules may be positioned above the floor
Data Source
AI summary
A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as—needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design.