Modular Server Motherboard QPI Interconnect Scalability

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Solution Overview

Problem

The high cost of motherboards with multiple CPUs and the wastefulness of discarding single-CPU motherboards due to incompatibility issues when upgrading processing power, as companies often need to match increasing user demands for processing speed.

Innovation Solution

A modular motherboard system where multiple CPU modules can be connected to form a server motherboard, allowing for the addition or removal of CPU modules to match processing requirements, with each module featuring a CPU, memory, chipset, input/output units, BIOS, and QPI connectors, enabling flexible CPU configuration and reducing the need for full motherboard replacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a motherboard with multiple CPUs is purchased to meet high processing speed requirements, then processing capability is improved, but cost increases significantly

Engineering Contradiction:
Improveprocessing capabilityVSAvoidcost
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The invention divides the traditional single motherboard into multiple independent motherboard modules, each containing a CPU. These modules can be connected in series to form a multi-CPU system. This segmentation allows the system to achieve multi-CPU processing capability through module composition rather than requiring a single complex motherboard, thereby reducing cost while maintaining processing capability.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If a single CPU motherboard is purchased to reduce cost, then cost is reduced, but processing speed becomes insufficient when user demands increase

Engineering Contradiction:
ImprovecostVSAvoidprocessing speed
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The invention creates a dynamic multi-CPU system where motherboard modules can be added or removed based on processing requirements. The system transitions from a static single-CPU configuration to a dynamic multi-CPU configuration through the addition of modules connected via QPI interfaces, allowing processing speed to scale with user demands without replacing the entire motherboard.

Inventive Principle:
Principle #15Dynamics

3Productivity

If a motherboard with multiple CPUs is purchased to match increasing processing requirements, then processing speed is improved, but compatibility issues require discarding the original single CPU motherboard

Engineering Contradiction:
Improveprocessing speedVSAvoidwaste
Core Design Contradiction:
ProductivityVSLoss of substance

Solution Approach 1:

The invention creates universal motherboard modules that can function independently as single-CPU units or be combined to form multi-CPU systems. The first motherboard module can operate standalone or connect with second motherboard module(s) through QPI interfaces, allowing the same hardware components to serve multiple processing configurations and eliminating the need to discard original modules when upgrading.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Productivity

If multiple motherboard modules are connected to increase CPU count, then processing capability is improved, but system complexity increases

Engineering Contradiction:
Improveprocessing capabilityVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The invention uses QPI (Quick Path Interface) connectors as intermediaries to connect motherboard modules. The QPI interface provides a standardized communication protocol and physical connection method between modules, simplifying the inter-module communication and reducing system complexity despite having multiple modules. The chipset in each module also acts as an intermediary for managing I/O operations and CPU communication.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9189245B2Motherboard in a server
Publication Date: 2015.11.17 INVENTEC PUDONG TECH CORPOARTION
  • US9189245B2 patent drawing
  • US9189245B2 patent drawing
  • US9189245B2 patent drawing

AI summary

A server comprises a first motherboard module. The first motherboard module comprises a first motherboard, a first CPU, at least one first memory module, a chipset, input/output units, a BIOS unit and a first QPI connector. The first CPU is disposed on the first motherboard. The first memory module electrically couples with the first CPU. The chipset electrically couples with the first CPU. The input/output units electrically couple with the chipset. The BIOS unit electrically couples with the chipset. The first QPI connector electrically couples with the first CPU through a QPI bus. The first QPI connector is connected to a second motherboard module.