Modular Shelf Interconnect Layout for Cooling Multi-Processor Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic devices with multiple CPUs and xPUs connected through a backplane suffer from heat dissipation issues and high signal integrity loss, necessitating the use of a retimer chip to resolve high-speed link problems, which affects flexibility and cost-effectiveness.
Innovation Solution
A backplane-free design with cable connections between shelves, allowing for flexible distribution of processors and eliminating the need for a retimer chip, while incorporating heat sinks and a heat exchanger for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If CPUs and xPUs are connected through a backplane in the same shelf, then signal transmission is achieved, but heat dissipation capability deteriorates and signal integrity loss increases
Solution Approach 1:
The system divides the electronic device into multiple independent shelves, with each shelf containing a processor and connector. This segmentation allows heat to be distributed across multiple shelves rather than concentrated in one location, improving heat dissipation while maintaining signal integrity through direct connector-to-connector connections between shelves.
2Reliability
If a retimer chip is added to resolve high-speed link problems, then signal integrity is improved, but device complexity and cost increase
Solution Approach 1:
The invention extracts and removes the retimer chip from the system by implementing direct connector-to-connector connections between shelves. This eliminates the need for additional signal regeneration components, reducing device complexity and cost while maintaining high-speed link performance through optimized physical layer connections.
3Adaptability or versatility
If all processors are located in the same shelf, then connection through backplane is achieved, but flexibility and convenience of shelf stacking and expansion deteriorate
Solution Approach 1:
Each shelf is designed as a universal module that can function independently or be stacked with other shelves. The connector design allows any shelf to connect to multiple other shelves, enabling flexible configurations and expansions without requiring different component arrangements, thereby simplifying overall system configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capability, improves flexibility and cost-effectiveness, and optimizes space utilization by allowing customizable shelf stacking and expansion without the need for additional chips.
Implementation Method 1
each shelf further includes a heat sink, and the first processor in any shelf is connected to the heat sink located in the same shelf
Implementation Method 2
heat sink
Implementation Method 3
incorporating heat sinks and a heat exchanger for improved heat dissipation
Data Source
AI summary
This application provides an electronic device and a heat dissipation system. The electronic device includes a plurality of shelves. Each shelf includes a first processor, a first mainboard, and a connector. The first mainboard in any shelf is separately connected to the first processor and the connector that are located in the same shelf. The connector in a first shelf is separately connected to the connector in at least one second shelf.