Modular Shielded Electrical Connector for High-Density Signal Integrity

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Solution Overview

Problem

Current electrical connectors face challenges in maintaining high signal integrity at high frequencies while maintaining high density, as conventional methods increase connector size and manufacturing complexity, and fail to effectively reduce skew and crosstalk in high-frequency signals.

Innovation Solution

The design incorporates a modular connector system with shielded modules arranged in a two-dimensional array, using electromagnetic shielding material to separate adjacent modules, and employing lossy materials and compliant members to reduce crosstalk and skew, while maintaining a compact form factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional shielding methods are used to reduce crosstalk and skew, then signal integrity improves, but connector size and manufacturing complexity increase

Engineering Contradiction:

Improvesignal integrityVSAvoidconnector complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The connector is divided into multiple modules, each containing a subset of signal conductors and an integrated shield. This segmentation allows the shield to be locally optimized for each module while reducing overall complexity compared to a single large shield structure. Each module can be manufactured independently and then assembled into the complete connector.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield is integrated directly with the housing structure, merging two previously separate components (shield and housing) into a unified structure. This integration eliminates the need for separate shield assemblies and reduces manufacturing steps while maintaining effective shielding between adjacent signal conductors.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If conventional shielding methods are used to reduce crosstalk and skew, then signal integrity improves, but manufacturing complexity increases

Engineering Contradiction:

Improvesignal integrityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The shield is formed as an integral part of the housing through a single molding process, combining what would traditionally be separate manufacturing steps into one operation. This integration significantly reduces assembly operations and simplifies the manufacturing workflow while maintaining effective electromagnetic shielding.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing is constructed using composite materials that provide both mechanical support and electromagnetic shielding properties. This allows a single component to fulfill multiple functions, reducing the total number of parts and simplifying manufacturing while maintaining signal integrity at high frequencies.

Inventive Principle:

Principle #40Composite materials

3Productivity

If signal conductor density is increased, then data transmission capacity improves, but electrical interference between adjacent conductors increases

Engineering Contradiction:

Improvedata transmission capacityVSAvoidelectrical interference

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The shield is positioned in close proximity to each signal conductor, providing localized electromagnetic protection exactly where interference occurs. This local shielding approach is more effective than distant shielding and allows for higher conductor density while maintaining signal quality, as each conductor has its own dedicated shield barrier.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The connector is divided into multiple modules, each containing a subset of signal conductors with integrated shielding. This segmentation creates natural electromagnetic isolation zones between groups of conductors, allowing higher overall density while preventing interference through the modular shield structure.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves signal integrity for frequencies up to 40 GHz, reduces manufacturing complexity, and allows for a higher density of signal pairs without increasing connector size, thereby enhancing electrical performance and reducing manufacturing costs.

Implementation Method 1

using electromagnetic shielding material to separate adjacent modules

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

employing lossy materials and compliant members to reduce crosstalk and skew

Methodology Applied

Scientific EffectElectromagnetic absorption: Absorption (EM radiation)

Data Source

PatentUS12184012B2High speed, high density electrical connector with shielded signal paths preliminary class

Publication Date: 2024.12.31 AMPHENOL CORP

AI summary

A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.