Modular Silicon Photonic Integration for Custom Heterogeneous Architectures
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Solution Overview
Problem
The integration sequence of various functional materials in existing silicon-based heterogeneous photoelectric integration is highly dependent, making it difficult to easily achieve customized selection and combination of these materials.
Innovation Solution
A modularized integration method for a silicon-based heterogeneous photoelectric integrated architecture, involving the integration of ultra-low-loss, high-frequency, and integrated circuit modules on a first silicon wafer, followed by wafer-level bonding with a second silicon wafer containing a laser material module, and subsequent steps of substrate thinning, redistribution layer electrode formation, and through silicon via creation to form a modularized silicon-based heterogeneous photoelectric integrated architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a fixed integration sequence of functional materials is used, then the manufacturing process is simplified, but the adaptability and customization capability are reduced
Solution Approach 1:
The patent divides the photoelectric integrated device into multiple independent functional modules (silicon photonic module, ultra-low-loss material module, high-frequency material module, laser material module, integrated circuit module). Each module can be independently fabricated, tested, and then selectively combined through wafer-level bonding to create customized integrated devices, thereby maintaining manufacturing simplicity while enabling high adaptability.
2Adaptability or versatility
If multiple types of functional material modules are integrated, then the versatility and application range are improved, but the device complexity increases
Solution Approach 1:
By segmenting the device into standardized functional modules, the patent enables versatile applications through selective combination of modules, while managing complexity through modular design that allows each module to be independently optimized and fabricated using mature processes.
Solution Approach 2:
The patent creates universal interface standards and wafer-level bonding protocols that allow different types of functional modules to be interconnected in various configurations. This universal approach enables the same module types to serve multiple functions depending on the application, increasing versatility without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for easy customization and combination of different functional materials, improving integration freedom and reducing costs by enabling up to 22 types of module-combined integrated architectures, including high-frequency and ultra-low-loss material modules with thin film lithium niobate and III-V laser devices.
Implementation Method 1
Lithium niobate thin films exhibit excellent electro-optic, non-linear optical, and thermoelectric properties... Compared to silicon-based modulators, lithium niobate thin film modulators can achieve ultra-high-speed modulation with low power consumption and low loss.
Implementation Method 2
indium phosphide (InP) and other III-V group compounds... making them conventional manufacturing materials for laser sources in communication bands.
Implementation Method 3
after a silicon photonic functional device is fabricated on an SOI wafer, thin film lithium niobate is bonded to a silicon photonic wafer
Data Source
AI summary
The present invention relates to an integration method for a modularized silicon-based heterogeneous photoelectric integrated architecture. According to the integration method, a modularized form is adopted, different functional units are used as individual unit modules, and then different types of integrated architectures are formed through customized increase and decrease in different usage scenarios. Among them, customized combinations of one unit module, two unit modules up to five unit modules can be adopted to construct up to 22 types of module-combined integrated architectures. By adopting a modularized solution, various functional materials can be easily selected and combined, thus improving a degree of freedom of integration and reducing costs.