Modular SiP Cellular Assembly for Rapid M2M Sensor Integration
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Solution Overview
Problem
Current machine-to-machine (M2M) communication devices are expensive, time-consuming to develop, and difficult to customize, lacking integration with the latest technological standards.
Innovation Solution
A system-in-package (SiP) cellular assembly featuring a multi-layer printed circuit board with through holes and surface mount connectors, allowing for detachable and reversible connectivity, along with a customizable add-on board for rapid prototyping and integration with various sensors and technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional M2M communication devices are used, then connectivity functionality is provided, but development time is excessive and customization is difficult
Solution Approach 1:
The device is divided into a base module containing essential connectivity components (cellular radio, GPS, power management) and separate add-on boards for sensors and functionality. This segmentation allows the base module to be pre-certified and reused, while only add-on boards require development and testing, dramatically reducing time to market.
Solution Approach 2:
The base module is designed as a universal platform that can support multiple different add-on boards through standardized mechanical and electrical interfaces. This multi-functionality allows a single base module to serve various M2M applications by simply changing the add-on board, accelerating development of different products.
2Adaptability or versatility
If traditional M2M devices are used, then basic connectivity is achieved, but adaptability to different applications and sensors is limited
Solution Approach 1:
By separating the device into a fixed base module and configurable add-on boards, the system achieves high adaptability without increasing overall complexity. Each add-on board is a self-contained module with defined interfaces, making integration straightforward despite the variety of possible configurations.
Solution Approach 2:
The system allows dynamic reconfiguration of functionality by swapping add-on boards based on application requirements. The standardized interfaces enable easy attachment and detachment of different sensor boards, allowing the system to adapt to various applications without redesigning the entire device.
3Productivity
If rapid prototyping is enabled through modular design, then development time is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The standardized universal interfaces are designed with tolerance compensation features that work across different manufacturing batches. The mechanical and electrical interfaces incorporate alignment features and tolerance zones that maintain reliable connections without requiring extremely tight manufacturing tolerances, enabling rapid prototyping while managing manufacturing precision requirements.
Data Source
AI summary
A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.