Modular Space Transformer for Fine Pitch Probing
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Solution Overview
Problem
Conventional space transformers in integrated circuit testing face challenges with reduced manufacturing yield and increased costs as minimum pitch decreases, and mechanical stress leads to deformation and fragility, making them cumbersome to repair.
Innovation Solution
A modular space transformer design featuring a guide plate with fine pitch apertures, compliant pins, and flexible interconnects, allowing for easier assembly and use, and accommodating finer pitches and complex wiring arrangements, using materials like silicon and insulating coatings, and incorporating flexible circuits and wire bonding strategies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional wired space transformers are used to route electrical contacts from small pitches on probe heads to larger pitches on PCBs, then electrical connections are established, but manufacturing yield is reduced and costs increase as minimum pitch is reduced
Solution Approach 1:
The space transformer is divided into multiple modular segments or layers, each handling a portion of the pitch transformation. This segmentation allows each layer to be optimized independently for fine pitch applications, improving manufacturing yield while maintaining the overall pitch transformation function.
Solution Approach 2:
The patent transitions from a planar wired space transformer to a three-dimensional modular architecture. By stacking multiple layers or modules vertically, the design accommodates finer pitches in the horizontal plane while maintaining manufacturability through the vertical dimension, thus resolving the contradiction between minimum pitch and manufacturing yield.
2Productivity
If the number of interconnect contacts is increased for parallel device testing, then testing capability is improved, but mechanical stress on the space transformer increases causing physical deformation
Solution Approach 1:
The space transformer is divided into multiple modular segments or layers, each handling a portion of the pitch transformation. This segmentation allows each layer to be optimized independently for fine pitch applications, improving manufacturing yield while maintaining the overall pitch transformation function.
Solution Approach 2:
The patent transitions from a planar wired space transformer to a three-dimensional modular architecture. By stacking multiple layers or modules vertically, the design accommodates finer pitches in the horizontal plane while maintaining manufacturability through the vertical dimension, thus resolving the contradiction between minimum pitch and manufacturing yield.
3Productivity
If the number of interconnect contacts is increased for parallel device testing, then testing capability is improved, but the space transformer becomes more fragile and cumbersome to repair
Solution Approach 1:
The space transformer is divided into multiple modular segments or layers, each handling a portion of the pitch transformation. This segmentation allows each layer to be optimized independently for fine pitch applications, improving manufacturing yield while maintaining the overall pitch transformation function.
Solution Approach 2:
The patent transitions from a planar wired space transformer to a three-dimensional modular architecture. By stacking multiple layers or modules vertically, the design accommodates finer pitches in the horizontal plane while maintaining manufacturability through the vertical dimension, thus resolving the contradiction between minimum pitch and manufacturing yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular space transformer enhances manufacturing yield, reduces mechanical stress, and improves reliability by allowing finer pitches and more complex wiring, while maintaining stability and ease of assembly, enabling operation at high frequencies and reducing manufacturing costs.
Implementation Method 1
compliant pins
Data Source
AI summary
In an embodiment, a modular space transformer for use in a probe card assembly includes a bottom plate, a guide plate, and a top plate. The guide plate is configured for mounting in a cut-out of the bottom plate. The guide plate has a first surface and a second surface and additionally has a first plurality of spaced electrical connections disposed in a plurality of apertures formed through the guide plate for providing electrical connections between a plurality of test probe contacts and a plurality of guide plate contacts. The top plate has a plurality of spaced electrical contacts disposed through the top plate with at least one of the plurality of guide plate contacts electrically connected to at least one of the plurality of spaced electrical contacts.